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1. 
Cover image for Stimuli-Responsive Dewetting/Wetting Smart Surfaces and Interfaces
Stimuli-Responsive Dewetting/Wetting Smart Surfaces and Interfaces
Author 
Hozumi, Atsushi. editor. Jiang, Lei. editor. Lee, Haeshin. editor. Shimomura, Masatsugu. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-92654-4
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2. 
Cover image for Industry Interactive Innovations in Science, Engineering and Technology Proceedings of the International Conference, I3SET 2016
Industry Interactive Innovations in Science, Engineering and Technology Proceedings of the International Conference, I3SET 2016
Author 
Bhattacharyya, Swapan. editor. Sen, Sabyasachi. editor. Dutta, Meghamala. editor. Biswas, Papun. editor. Chattopadhyay, Himadri. editor.
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Electronic Access 
https://doi.org/10.1007/978-981-10-3953-9
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3. 
Cover image for Acute and Chronic Neural Stimulation via Mechano-Sensitive Ion Channels
Acute and Chronic Neural Stimulation via Mechano-Sensitive Ion Channels
Author 
Tay, Andy Kah Ping. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-69059-9
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4. 
Cover image for Photocarcinogenesis & Photoprotection
Photocarcinogenesis & Photoprotection
Author 
Ray, Ratan Singh. editor. Haldar, Chandana. editor. Dwivedi, Ashish. editor. Agarwal, Neeraj. editor. Singh, Jyoti. editor.
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https://doi.org/10.1007/978-981-10-5493-8
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5. 
Cover image for Nanobiotechnology Applications in Plant Protection
Nanobiotechnology Applications in Plant Protection
Author 
Abd-Elsalam, Kamel A. editor. Prasad, Ram. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-91161-8
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6. 
Cover image for Fungal Nanobionics: Principles and Applications
Fungal Nanobionics: Principles and Applications
Author 
Prasad, Ram. editor. Kumar, Vivek. editor. Kumar, Manoj. editor. Wang, Shanquan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-8666-3
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7. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-77872-3
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8. 
Cover image for Advanced Noncontact Cutting and Joining Technologies Micro- and Nano-manufacturing
Advanced Noncontact Cutting and Joining Technologies Micro- and Nano-manufacturing
Author 
Mahamood, Rasheedat Modupe. author. Akinlabi, Esther Titilayo. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-75118-4
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9. 
Cover image for Electrohydrodynamic Direct-Writing for Flexible Electronic Manufacturing
Electrohydrodynamic Direct-Writing for Flexible Electronic Manufacturing
Author 
Yin, Zhouping. author. Huang, Yongan. author. Duan, Yongqing. author. Zhang, Haitao. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-4759-6
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10. 
Cover image for Proton Exchange Membrane Fuel Cells Design, Modelling and Performance Assessment Techniques
Proton Exchange Membrane Fuel Cells Design, Modelling and Performance Assessment Techniques
Author 
Albarbar, Alhussein. author. Alrweq, Mohmad. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-70727-3
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11. 
Cover image for Analytical Modelling of Breakdown Effect in Graphene Nanoribbon Field Effect Transistor
Analytical Modelling of Breakdown Effect in Graphene Nanoribbon Field Effect Transistor
Author 
Amiri, Iraj Sadegh. author. Ghadiry, Mahdiar. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-6550-7
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12. 
Cover image for Interfacial Phenomena on Biological Membranes
Interfacial Phenomena on Biological Membranes
Author 
Arakha, Manoranjan. author. Jha, Suman. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-73326-5
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