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1. 
Cover image for Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Author 
Cheng, Jie. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-6165-3
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2. 
Cover image for Springer Handbook of Nanotechnology
Springer Handbook of Nanotechnology
Author 
Bhushan, Bharat. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-02525-9
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3. 
Cover image for Nanotribology and Nanomechanics An Introduction
Nanotribology and Nanomechanics An Introduction
Author 
Bhushan, Bharat. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-77608-6
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4. 
Cover image for Transparent Electronics
Transparent Electronics
Author 
Wager, John F. author. Keszler, Douglas A. author. Presley, Rick E. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-72342-6
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5. 
Cover image for Springer Handbook of Nanotechnology
Springer Handbook of Nanotechnology
Author 
Bhushan, Bharat. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-29857-1
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6. 
Cover image for Nanotechnology and Nanoelectronics Materials, Devices, Measurement Techniques
Nanotechnology and Nanoelectronics Materials, Devices, Measurement Techniques
Author 
Fahrner, W. R. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b137771
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7. 
Cover image for Nanotribology and Nanomechanics An Introduction
Nanotribology and Nanomechanics An Introduction
Author 
Bhushan, Bharat. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/3-540-28248-3
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8. 
Cover image for Diffusion Processes in Advanced Technological Materials
Diffusion Processes in Advanced Technological Materials
Author 
Gupta, Devendra. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-27470-4
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