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2018
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1. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-319-77872-3
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2. 
Cover image for Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Author 
Cheng, Jie. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-6165-3
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3. 
Cover image for Laser Metal Deposition Process of Metals, Alloys, and Composite Materials
Laser Metal Deposition Process of Metals, Alloys, and Composite Materials
Author 
Mahamood, Rasheedat Modupe. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-64985-6
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4. 
Cover image for Advances in Materials Processing Proceedings of Chinese Materials Conference 2017
Advances in Materials Processing Proceedings of Chinese Materials Conference 2017
Author 
Han, Yafang. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-13-0107-0
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