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1. 
Cover image for Nanostructured Materials for Engineering Applications
Nanostructured Materials for Engineering Applications
Author 
Bergmann, Carlos Pérez. editor. Andrade, Mônica Jung. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-19131-2
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Cover image for Nanoscience and Engineering in Superconductivity
Nanoscience and Engineering in Superconductivity
Author 
Moshchalkov, Victor. editor. Woerdenweber, Roger. editor. Lang, Wolfgang. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-15137-8
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3. 
Cover image for Fundamentals of Solid State Engineering
Fundamentals of Solid State Engineering
Author 
Razeghi, Manijeh. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-92168-6
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4. 
Cover image for Fundamentals of Solid State Engineering
Fundamentals of Solid State Engineering
Author 
Razeghi, Manijeh. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-28751-5
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5. 
Cover image for Swift Heavy Ions for Materials Engineering and Nanostructuring
Swift Heavy Ions for Materials Engineering and Nanostructuring
Author 
Avasthi, D. K. author. Mehta, G. K. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-94-007-1229-4
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6. 
Cover image for Synthesis and Characterization of Piezotronic Materials for Application in Strain/Stress Sensing
Synthesis and Characterization of Piezotronic Materials for Application in Strain/Stress Sensing
Author 
Zhu, Ren. author. Yang, Rusen. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-70038-0
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7. 
Cover image for Tuneable Film Bulk Acoustic Wave Resonators
Tuneable Film Bulk Acoustic Wave Resonators
Author 
Gevorgian, Spartak Sh. author. Tagantsev, Alexander K. author. Vorobiev, Andrei K. author. SpringerLink (Online service)
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ONLINE(331105.1)
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http://dx.doi.org/10.1007/978-1-4471-4944-6
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8. 
Cover image for Porous Semiconductors Optical Properties and Applications
Porous Semiconductors Optical Properties and Applications
Author 
Kochergin, Vladimir. author. Föll, Helmut. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84882-578-9
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9. 
Cover image for Fabrication of Complex Optical Components From Mold Design to Product
Fabrication of Complex Optical Components From Mold Design to Product
Author 
Brinksmeier, Ekkard. editor. Riemer, Oltmann. editor. Gläbe, Ralf M. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-33001-8
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10. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-85729-310-7
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11. 
Cover image for Analog Design Essentials
Analog Design Essentials
Author 
Sansen, Willy M. C. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b135984
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12. 
Cover image for Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-8884-1
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