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1. 
Cover image for Packaging for Sustainability
Packaging for Sustainability
Author 
Verghese, Karli. editor. Lewis, Helen. editor. Fitzpatrick, Leanne. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-988-8
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2. 
Cover image for Bionanocomposites for Packaging Applications
Bionanocomposites for Packaging Applications
Author 
Jawaid, Mohammad. editor. Swain, Sarat Kumar. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-67319-6
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3. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-78219-5
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4. 
Cover image for Fuel Cell Electronics Packaging
Fuel Cell Electronics Packaging
Author 
Kuang, Ken. editor. Easler, Keith. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-47324-6
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5. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330808.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5768-9
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6. 
Cover image for Packaging for Food Preservation
Packaging for Food Preservation
Author 
Del Nobile, Matteo Alessandro. author. Conte, Amalia. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332324.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-7684-9
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7. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-9917-8
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8. 
Cover image for Innovative Technologies for Printing and Packaging
Innovative Technologies for Printing and Packaging
Author 
Xu, Min. editor. Yang, Li. editor. Zhang, Linghao. editor. Yan, Shu. editor. SpringerLink (Online service)
Preferred Shelf Number 
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Electronic Access 
https://doi.org/10.1007/978-981-19-9024-3
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9. 
Cover image for Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-10-8884-1
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10. 
Cover image for RF and Microwave Microelectronics Packaging
RF and Microwave Microelectronics Packaging
Author 
Kuang, Ken. editor. Kim, Franklin. editor. Cahill, Sean S. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0984-8
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11. 
Cover image for Nanopackaging Nanotechnologies and Electronics Packaging
Nanopackaging Nanotechnologies and Electronics Packaging
Author 
Morris, James E. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-47325-3
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12. 
Cover image for Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections
Author 
Greig, William J. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/0-387-33913-2
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