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1. 
Cover image for The theory of measures and integration
The theory of measures and integration
Author 
Vestrup, Eric M., 1971- Wiley InterScience (Online service)
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Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=469988
John Wiley http://dx.doi.org/10.1002/9780470317112
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley044/2003053475.html
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2. 
Cover image for Lebesgue measure and integration an introduction
Lebesgue measure and integration an introduction
Author 
Burk, Frank. Wiley InterScience (Online service)
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Wiley InterScience An electronic book accessible through the World Wide Web; click for information
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley047/97006510.html
http://site.ebrary.com/lib/alltitles/Doc?id=10504241
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3. 
Cover image for The elements of integration and Lebesgue measure
The elements of integration and Lebesgue measure
Author 
Bartle, Robert Gardner, 1927- Wiley InterScience (Online service)
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Wiley InterScience An electronic book accessible through the World Wide Web; click for information
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=818911
http://site.ebrary.com/lib/alltitles/Doc?id=10501301
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4. 
Cover image for Application integration EAI, B2B, BPM and SOA
Application integration EAI, B2B, BPM and SOA
Author 
Manouvrier, Bernard. Ménard, Laurent. Wiley InterScience (Online service)
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John Wiley http://dx.doi.org/10.1002/9780470611739
MyiLibrary, Table of contents http://www.myilibrary.com?id=216543&ref=toc
Contributor biographical information http://catdir.loc.gov/catdir/enhancements/fy0901/2008014999-b.html
http://site.ebrary.com/lib/alltitles/Doc?id=10361305
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5. 
Cover image for Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author 
Li, Er-Ping. Wiley InterScience (Online service)
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IEEEXplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551
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6. 
Cover image for Ceramic integration and joining technologies from macro to nanoscale
Ceramic integration and joining technologies from macro to nanoscale
Author 
Singh, M. (Mrityunjay) Wiley InterScience (Online service)
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Wiley InterScience An electronic book accessible through the World Wide Web; click for information
Wiley http://onlinelibrary.wiley.com/book/10.1002/9781118056776
ebrary http://site.ebrary.com/id/10501333
Knovel http://app.knovel.com/web/toc.v/cid:kpCIJTFMN1
http://site.ebrary.com/lib/alltitles/Doc?id=10501333
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7. 
Cover image for Activated carbon for water and wastewater treatment integration of adsorption and biological treatment
Activated carbon for water and wastewater treatment integration of adsorption and biological treatment
Author 
Çeçen, Ferhan. Aktaş, Özgür. Wiley InterScience (Online service)
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Wiley InterScience An electronic book accessible through the World Wide Web; click for information
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8. 
Cover image for Organic thin film transistor integration a hybrid approach
Organic thin film transistor integration a hybrid approach
Author 
Li, F. M. (Flora M.) Wiley InterScience (Online service)
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Wiley InterScience An electronic book accessible through the World Wide Web; click for information
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Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=693857
ebrary http://site.ebrary.com/id/10713563
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9. 
Cover image for Planning and integration of refinery and petrochemical operations
Planning and integration of refinery and petrochemical operations
Author 
Al-Qahtani, Khalid Y. Elkamel, Ali. Wiley InterScience (Online service)
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John Wiley http://dx.doi.org/10.1002/9783527630844
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10. 
Cover image for Isogeometric analysis toward integration of CAD and FEA
Isogeometric analysis toward integration of CAD and FEA
Author 
Cottrell, J. Austin. Hughes, Thomas J. R. Bazilevs, Yuri. Wiley InterScience (Online service)
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Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=454286
John Wiley http://dx.doi.org/10.1002/9780470749081
http://site.ebrary.com/lib/alltitles/Doc?id=10325824
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11. 
Cover image for Carbon nanotube devices properties, modeling, integration and applications
Carbon nanotube devices properties, modeling, integration and applications
Author 
Hierold, Christofer. Wiley InterScience (Online service)
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Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=481315
John Wiley http://dx.doi.org/10.1002/9783527622597
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12. 
Cover image for Handbook of 3D integration technology and applications of 3D integrated circuits
Handbook of 3D integration technology and applications of 3D integrated circuits
Author 
Garrou, Philip E. Bower, Christopher Andrew. Ramm, Peter. Wiley InterScience (Online service)
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John Wiley http://dx.doi.org/10.1002/9783527623051
ebrary http://site.ebrary.com/id/10577606
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