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1. 
Cover image for Reliability of Microtechnology Interconnects, Devices and Systems
Reliability of Microtechnology Interconnects, Devices and Systems
Author 
Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.
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http://dx.doi.org/10.1007/978-1-4419-5760-3
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2. 
Cover image for Solder Joint Reliability Prediction for Multiple Environments
Solder Joint Reliability Prediction for Multiple Environments
Author 
Perkins, Andrew E. author. Sitaraman, Suresh K. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-79394-8
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3. 
Cover image for Solder Joint Technology Materials, Properties, and Reliability
Solder Joint Technology Materials, Properties, and Reliability
Author 
Tu, King-Ning. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-38892-2
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4. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-85729-310-7
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5. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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6. 
Cover image for A Guide to Lead-free Solders Physical Metallurgy and Reliability
A Guide to Lead-free Solders Physical Metallurgy and Reliability
Author 
Evans, John W. author. Engelmaier, Werner. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84628-310-9
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