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1. 
Cover image for Metal-Metal Bonding
Metal-Metal Bonding
Author 
Parkin, Gerard. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-05243-9
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2. 
Cover image for Copper Wire Bonding
Copper Wire Bonding
Author 
Chauhan, Preeti S. author. Choubey, Anupam. author. Zhong, ZhaoWei. author. Pecht, Michael G. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-5761-9
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3. 
Cover image for Metal-ligand bonding
Metal-ligand bonding
Author 
Moore, E.A. Abel, Edward W. Janes, Rob. The Open University.
Preferred Shelf Number 
ONLINE(343977.1)
Electronic Access 
http://dx.doi.org/10.1039/9781847559456
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4. 
Cover image for Structure and bonding
Structure and bonding
Preferred Shelf Number 
ONLINE(343844.1)
Electronic Access 
http://dx.doi.org/10.1039/9781847551955
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5. 
Cover image for Handbook of wafer bonding
Handbook of wafer bonding
Author 
Ramm, Peter. Lu, James Jian-Qiang. Taklo, Maaike M. V.
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527644223
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=822735
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6. 
Cover image for Halogen bonding in solution
Halogen bonding in solution
Author 
Huber, Stefan, editor.
Preferred Shelf Number 
QD165 .H36 2021
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527825738
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7. 
Cover image for Bonding systems and equipment
Bonding systems and equipment
Author 
Bierals, Gregory P., 1946- author.
Preferred Shelf Number 
TK152
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9788770048170
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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8. 
Cover image for Bonding in Microsystem Technology
Bonding in Microsystem Technology
Author 
Dziuban, Jan A. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-4020-4589-1
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9. 
Cover image for Hydrogen Bonding—New Insights
Hydrogen Bonding—New Insights
Author 
Grabowski, Sławomir J. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-4853-1
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10. 
Cover image for Molecular modelling and bonding
Molecular modelling and bonding
Author 
Moore, Elaine (Elaine A.) Open University.
Preferred Shelf Number 
ONLINE(312866.1)
Electronic Access 
Knovel http://app.knovel.com/web/toc.v/cid:kpMWMMB007
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11. 
Cover image for Halogen Bonding Fundamentals and Applications
Halogen Bonding Fundamentals and Applications
Author 
Metrangolo, P. editor. Resnati, G. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-74330-9
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12. 
Cover image for The language of grounding and bonding
The language of grounding and bonding
Author 
Bierals, Gregory P., 1946- author.
Preferred Shelf Number 
TK3227
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9788770048095
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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