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1. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-1556-9
Format: 
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2. 
Cover image for From LED to solid state lighting : principles, materials, packaging, characterization, and applications
From LED to solid state lighting : principles, materials, packaging, characterization, and applications
Author 
Lee, Shi-Wei Ricky, author. Lo, Jeffery C. C., author. Tao, Mian, author. Ye, Huaiyu, author.
Preferred Shelf Number 
TK7871.89 .L53 L4365 2021
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781118881620
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3. 
Cover image for Advances in embedded and fan-out wafer level packaging technologies
Advances in embedded and fan-out wafer level packaging technologies
Author 
Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.
Preferred Shelf Number 
TK7870.17 .A38 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991
Format: 
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4. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-45098-8
Format: 
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5. 
Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes
MEMS/MOEMS packaging concepts, designs, materials, and processes
Author 
Gilleo, Ken.
Preferred Shelf Number 
ONLINE
Electronic Access 
Subscription required
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6. 
Cover image for Microwave Field-Effect Transistors Theory, design and applications
Microwave Field-Effect Transistors Theory, design and applications
Author 
Pengelly, Raymond S.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/SBEW016E
Format: 
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