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1. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-9917-8
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2. 
Cover image for The Importance of Packaging Design for the Chemistry of Food Products
The Importance of Packaging Design for the Chemistry of Food Products
Author 
Brunazzi, Giovanni. author. Parisi, Salvatore. author. Pereno, Amina. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08452-7
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3. 
Cover image for Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author 
Li, Er-Ping. Wiley InterScience (Online service)
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ONLINE
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IEEEXplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551
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4. 
Cover image for Bottles, preforms and closures [a design guide for PET packaging
Bottles, preforms and closures [a design guide for PET packaging
Author 
Brandau, Ottmar.
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ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9781437735260
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5. 
Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1053-9
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6. 
Cover image for Really good packaging explained top design professionals critique 300 package designs & explain what makes them work
Really good packaging explained top design professionals critique 300 package designs & explain what makes them work
Author 
Edwards, Bronwen.
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ONLINE
Electronic Access 
EBSCOhost http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=571401
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7. 
Cover image for LED packaging for lighting applications design, manufacturing, and testing
LED packaging for lighting applications design, manufacturing, and testing
Author 
Liu, S. (Sheng), 1963- Luo, Xiaobing, 1974-
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ONLINE
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Click here to view book
John Wiley http://dx.doi.org/10.1002/9780470827857
http://site.ebrary.com/lib/alltitles/Doc?id=10490643
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8. 
Cover image for Packaging research in food product design and development
Packaging research in food product design and development
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Moskowitz, Howard R. Wiley InterScience (Online service)
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Wiley InterScience An electronic book accessible through the World Wide Web; click for information
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9. 
Cover image for Practical guide to the packaging of electronics : thermal and mechanical design and analysis
Practical guide to the packaging of electronics : thermal and mechanical design and analysis
Author 
Jamnia, Ali, 1961- author.
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TK7870.15 .J36 2009
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10. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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11. 
Cover image for Novel & Intelligent Digital Systems: Proceedings of the 3rd International Conference (NiDS 2023) Volume 2
Novel & Intelligent Digital Systems: Proceedings of the 3rd International Conference (NiDS 2023) Volume 2
Author 
Kabassi, Katerina. editor. Mylonas, Phivos. editor. Caro, Jaime. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-44146-2
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12. 
Cover image for Proceedings of 2nd International Conference on Artificial Intelligence, Robotics, and Communication ICAIRC 2022
Proceedings of 2nd International Conference on Artificial Intelligence, Robotics, and Communication ICAIRC 2022
Author 
Yadav, Sanjay. editor. Kumar, Harish. editor. Kankar, Pavan Kumar. editor. Dai, Wanyang. editor. Huang, Fenghua. editor.
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https://doi.org/10.1007/978-981-99-4554-2
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