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1. 
Cover image for Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author 
Li, Er-Ping. Wiley InterScience (Online service)
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ONLINE
Electronic Access 
IEEEXplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551
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2. 
Cover image for Bottles, preforms and closures [a design guide for PET packaging
Bottles, preforms and closures [a design guide for PET packaging
Author 
Brandau, Ottmar.
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ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9781437735260
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3. 
Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1053-9
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4. 
Cover image for Really good packaging explained top design professionals critique 300 package designs & explain what makes them work
Really good packaging explained top design professionals critique 300 package designs & explain what makes them work
Author 
Edwards, Bronwen.
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ONLINE
Electronic Access 
EBSCOhost http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=571401
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5. 
Cover image for LED packaging for lighting applications design, manufacturing, and testing
LED packaging for lighting applications design, manufacturing, and testing
Author 
Liu, S. (Sheng), 1963- Luo, Xiaobing, 1974-
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ONLINE
Electronic Access 
Click here to view book
John Wiley http://dx.doi.org/10.1002/9780470827857
http://site.ebrary.com/lib/alltitles/Doc?id=10490643
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6. 
Cover image for Practical guide to the packaging of electronics thermal and mechanical design and analysis
Practical guide to the packaging of electronics thermal and mechanical design and analysis
Author 
Jamnia, Ali, 1961-
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ONLINE
Electronic Access 
Distributed by publisher. Purchase or institutional license may be required for access.
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7. 
Cover image for Packaging research in food product design and development
Packaging research in food product design and development
Author 
Moskowitz, Howard R. Wiley InterScience (Online service)
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ONLINE
Electronic Access 
Wiley InterScience An electronic book accessible through the World Wide Web; click for information
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8. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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9. 
Cover image for Cognitive Systems and Information Processing 7th International Conference, ICCSIP 2022, Fuzhou, China, December 17-18, 2022, Revised Selected Papers
Cognitive Systems and Information Processing 7th International Conference, ICCSIP 2022, Fuzhou, China, December 17-18, 2022, Revised Selected Papers
Author 
Sun, Fuchun. editor. Cangelosi, Angelo. editor. Zhang, Jianwei. editor. Yu, Yuanlong. editor. Liu, Huaping. editor.
Preferred Shelf Number 
XX(520758.1)
Electronic Access 
https://doi.org/10.1007/978-981-99-0617-8
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10. 
Cover image for Application of nano/microencapsulated ingredients in food products
Application of nano/microencapsulated ingredients in food products
Author 
Jafari, Seid Mahdi.
Preferred Shelf Number 
XX(522480.1)
Electronic Access 
ScienceDirect https://www.sciencedirect.com/science/book/9780128157268
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11. 
Cover image for Industrial Engineering, Management Science and Applications 2015
Industrial Engineering, Management Science and Applications 2015
Author 
Gen, Mitsuo. editor. Kim, Kuinam J. editor. Huang, Xiaoxia. editor. Hiroshi, Yabe. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(518706.1)
Electronic Access 
https://doi.org/10.1007/978-3-662-47200-2
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12. 
Cover image for Extreme environment electronics
Extreme environment electronics
Author 
Cressler, John D. Mantooth, H. Alan, 1963-
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