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Library: Online Library

Author

Wiley InterScience (Online service)

(3)

Ben Dhia, Sonia.

(2)

Iniewski, Krzysztof.

(2)

Sicard, Etienne.

(2)

Wong, Ban P., 1953-

(2)

Baker, R. Jacob, 1964-

(1)

Baliga, B. Jayant, 1948-

(1)

Balsara, Poras T., 1961-

(1)

Binkley, David M.

(1)

(1)

Bowen, D. Keith (David Keith), 1940-

(1)

Brock, David C.

(1)

Brown, Marty, 1951-

(1)

Bruno, Giovanni.

(1)

Capezzuto, Pio.

(1)

Colino, Ronald P.

(1)

Cressler, John D.

(1)

Daly, James C., 1938-

(1)

Del Castillo, Enrique.

(1)

Doering, Robert, 1946-

(1)

Elsevier Science Publishers.

(1)

(1)

Galipeau, Denis P.

(1)

Handkiewicz, Andrzej.

(1)

Hurwitz, Arnon Max.

(1)

Jackson, Kenneth A.

(1)

John Wiley & Sons.

(1)

Jones, Anthony C.

(1)

(1)

(1)

(1)

(1)

Leung, Gerry Chi Tak.

(1)

Levitin, Valim.

(1)

Luong, Howard Cam.

(1)

Lécuyer, Christophe.

(1)

Mack, Raymond A.

(1)

Madan, A. (Arun)

(1)

(1)

(1)

Nishi, Yoshio, 1940-

(1)

O'Brien, Paul (University lecturer)

(1)

Ohmi, Tadahiro, 1939-

(1)

(1)

Palestri, Pierpaolo.

(1)

(1)

Pimbley, J. M. (Joseph M.)

(1)

Ramaswami, Sesh.

(1)

Rosa, José M. de la.

(1)

(1)

Schröter, W. (Wolfgang)

(1)

Schwartz, G. C.

(1)

(1)

Sheng, William W.

(1)

Smith, Bruce W., 1959-

(1)

Spanos, Costas J.

(1)

Sreedhar, Aswin.

(1)

Srikrishnan, K. V., 1948-

(1)

Staszewski, Robert Bogdan, 1965-

(1)

Suzuki, Kazuaki.

(1)

Symposium G on Atomic Scale Characterization and Simulation of Materials and Processes (1995 : Strasbourg, France)

(1)

Symposium N on Carbon, Hydrogen, Nitrogen, and Oxygen in Silicon and Other Elemental Semiconductors (1995 : Strasbourg, France)

(1)

Tam, Wing-Shan.

(1)

Tanner, B. K. (Brian Keith)

(1)

(1)

Wong, Terence K. S.

(1)

(1)

Language

(37)

Publication Date

-

(6)

(5)

(5)

(4)

(3)

(2)

(2)

(2)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

Subject

Metal oxide semiconductors, Complementary -- Design and construction.

(20)

Semiconductors -- Design and construction.

(9)

Electronic books.

(6)

Integrated circuits -- Design and construction.

(6)

Nanoelectronics.

(3)

Power semiconductors -- Design and construction.

(3)

Compound semiconductors.

(2)

Digital integrated circuits -- Design and construction.

(2)

Frequency synthesizers -- Design and construction.

(2)

Integrated circuits -- Very large scale integration -- Design and construction.

(2)

Schaltnetzteil.

(2)

Semiconductor switches -- Design and construction.

(2)

Silicon-on-insulator technology.

(2)

Switching circuits -- Design and construction.

(2)

Switching power supplies -- Design and construction.

(2)

Three-dimensional integrated circuits -- Design and construction.

(2)

Three-dimensional integrated circuits.

(2)

Wireless communication systems -- Equipment and supplies -- Design and construction.

(2)

Amorphous semiconductors -- Design and construction.

(1)

Bipolar integrated circuits -- Design and construction.

(1)

Bipolar transistors -- Design and construction.

(1)

Chemical bonds.

(1)

Chemical vapor deposition.

(1)

Compound semiconductors -- Congresses.

(1)

Compound semiconductors -- Design and construction -- Materials.

(1)

Compound semiconductors -- Design and construction.

(1)

Compound semiconductors -- Industrial applications -- Congresses.

(1)

(1)

(1)

Density functionals -- Computer simulation.

(1)

(1)

Electric circuit analysis.

(1)

Electric circuits -- Design and construction.

(1)

Electron transport.

(1)

Electronic apparatus and appliances -- Design and construction.

(1)

Electronic circuit design.

(1)

Electronic packaging.

(1)

Electronic structure.

(1)

(1)

(1)

(1)

Fairchild (Firm) -- Archives.

(1)

Fairchild (Firm) -- History.

(1)

(1)

Gate array circuits.

(1)

Image processing -- Digital techniques.

(1)

Integrated circuits -- Design and construction -- History.

(1)

Integrated circuits -- Masks.

(1)

Integrated circuits -- Measurement.

(1)

Integrated circuits industry.

(1)

Interconnects (Integrated circuit technology)

(1)

Linear integrated circuits -- Design and construction.

(1)

Manufacturing processes.

(1)

Materials science -- Computer simulation.

(1)

Mathematical models.

(1)

Metal oxide semiconductor field-effect transistors.

(1)

Metal oxide semiconductors -- Design and construction.

(1)

Microelectronic packaging.

(1)

Microlithography -- Industrial applications.

(1)

Mixed signal circuits -- Design and construction.

(1)

Multichip modules (Microelectronics)

(1)

Nanoelectronics -- Materials.

(1)

Nanostructure materials.

(1)

Plasma-enhanced chemical vapor deposition.

(1)

Process control -- Statistical methods.

(1)

Production management.

(1)

Radio circuits -- Design and construction.

(1)

Semiconductor industry -- Handbooks, manuals, etc.

(1)

Semiconductor industry -- Production control.

(1)

Semiconductor wafers -- Inspection.

(1)

Semiconductor wafers.

(1)

Semiconductors -- Analysis.

(1)

Semiconductors -- Cleaning.

(1)

Semiconductors -- Congresses.

(1)

Semiconductors -- Defects -- Congresses.

(1)

Semiconductors -- Defects.

(1)

Semiconductors -- Design and construction -- Congresses.

(1)

Semiconductors -- Design and construction -- Handbooks, manuals, etc.

(1)

Semiconductors -- Design and construction -- History.

(1)

Semiconductors -- Design and construction -- Materials.

(1)

Semiconductors -- Design and construction -- Quality control.

(1)

Semiconductors -- Junctions.

(1)

Semiconductors -- Materials.

(1)

Semiconductors -- Mathematical models -- Congresses.

(1)

Semiconductors -- Simulation methods -- Congresses.

(1)

Signal generators -- Design and construction.

(1)

(1)

Silicon -- Congresses.

(1)

Silicon alloys.

(1)

Silicon crystals -- Growth.

(1)

Silicon crystals.

(1)

(1)

TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- General.

(1)

TECHNOLOGY & ENGINEERING -- Electronics -- Semiconductors.

(1)

TECHNOLOGY & ENGINEERING -- Electronics -- Solid State.

(1)

TECHNOLOGY & ENGINEERING / Electronics / Optoelectronics

(1)

(1)

Three-dimensional imaging.

(1)

Three-dimensional integrated circuits -- Computer-aided design.

(1)

Three-dimensional integrated circuits -- Testing.

(1)

Voltage references.

(1)

Wide gap semiconductors.

(1)

X-rays -- Diffraction.

(1)

Material Type

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1.

Cover image for Interatomic bonding in solids fundamentals, simulation, applications

Interatomic bonding in solids fundamentals, simulation, applications

Interatomic bonding in solids fundamentals, simulation, applications

Author

Levitin, Valim.

Preferred Shelf Number

ONLINE(342212.1)

Electronic Access

John Wiley http://dx.doi.org/10.1002/9783527671557

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2.

Cover image for CMOS sigma-delta converters practical design guide

CMOS sigma-delta converters practical design guide

CMOS sigma-delta converters practical design guide

Author

Rosa, José M. de la. Río, R. del.

Preferred Shelf Number

ONLINE

Electronic Access

IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6497231

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3.

Cover image for Through-silicon vias for 3D integration

Through-silicon vias for 3D integration

Through-silicon vias for 3D integration

Author

Lau, John.

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ONLINE

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4.

Cover image for CMOS voltage references an analytical and practical perspective

CMOS voltage references an analytical and practical perspective

CMOS voltage references an analytical and practical perspective

Author

Kok, Chi-Wah. Tam, Wing-Shan.

Preferred Shelf Number

ONLINE

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IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6462190

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5.

Cover image for Semiconductor strain metrology principles and applications

Semiconductor strain metrology principles and applications

Semiconductor strain metrology principles and applications

Author

Wong, Terence K. S.

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ONLINE

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EBSCOhost http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=500610

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6.

Cover image for Nano-CMOS gate dielectric engineering

Nano-CMOS gate dielectric engineering

Nano-CMOS gate dielectric engineering

Author

Wong, Hei.

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ONLINE

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Distributed by publisher. Purchase or institutional license may be required for access.

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7.

Cover image for Nanoscale CMOS VLSI circuits design for manufacturability

Nanoscale CMOS VLSI circuits design for manufacturability

Nanoscale CMOS VLSI circuits design for manufacturability

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Kundu, Sandip. Sreedhar, Aswin.

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ONLINE

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8.

Cover image for Basics of CMOS cell design

Basics of CMOS cell design

Basics of CMOS cell design

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Sicard, Etienne. Ben Dhia, Sonia.

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Cover image for Advanced circuits for emerging technologies

Advanced circuits for emerging technologies

Advanced circuits for emerging technologies

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Iniewski, Krzysztof.

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ONLINE

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Connect to MyiLibrary resource
Wiley InterScience http://dx.doi.org/10.1002/9781118181508
Wiley http://dx.doi.org/10.1002/9781118181508

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Cover image for 3D IC stacking technology

3D IC stacking technology

3D IC stacking technology

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Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.

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Cover image for Advanced CMOS cell design

Advanced CMOS cell design

Advanced CMOS cell design

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Sicard, Etienne. Ben Dhia, Sonia.

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12.

Cover image for Nanoscale MOS Transistors Semi-Classical Transport and Applications

Nanoscale MOS Transistors Semi-Classical Transport and Applications

Nanoscale MOS Transistors Semi-Classical Transport and Applications

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Esseni, David. Palestri, Pierpaolo. Selmi, Luca.

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