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1. 
Cover image for Multisensor Fusion and Integration in the Wake of Big Data, Deep Learning and Cyber Physical System An Edition of the Selected Papers from the 2017 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI 2017)
Multisensor Fusion and Integration in the Wake of Big Data, Deep Learning and Cyber Physical System An Edition of the Selected Papers from the 2017 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI 2017)
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Lee, Sukhan. editor. Ko, Hanseok. editor. Oh, Songhwai. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-90509-9
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Cover image for Gas Turbine Design, Components and System Design Integration
Gas Turbine Design, Components and System Design Integration
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Schobeiri, Meinhard T. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-58378-5
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Cover image for Network-on-chip : the next generation of system-on-chip integration
Network-on-chip : the next generation of system-on-chip integration
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Kundu, Santanu, author. Chattopadhyay, Santanu, contributor.
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Distributed by publisher. Purchase or institutional license may be required for access.
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4. 
Cover image for Wind Power Integration Connection and System Operational Aspects
Wind Power Integration Connection and System Operational Aspects
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Fox, Brendan Bryans, Leslie Flynn, Damian Jenkins, Nick Milborrow, David
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\(364920.1)
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http://dx.doi.org/10.1049/PBRN014E
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5. 
Cover image for System design and control integration for advanced manufacturing
System design and control integration for advanced manufacturing
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Li, Han-Xiong, author. Lu, XinJiang (Manufacturing researcher), author.
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ONLINE(341830.1)
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Ebook Library http://public.eblib.com/choice/PublicFullRecord.aspx?p=1818247
John Wiley http://dx.doi.org/10.1002/9781118822401
http://swb.eblib.com/patron/FullRecord.aspx?p=1818247
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6. 
Cover image for Driving sustainability to business success : the DS factor-management system integration and automation
Driving sustainability to business success : the DS factor-management system integration and automation
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Pilot, Jayne.
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ONLINE(342062.1)
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Ebook Library Click here to view book
Cover image http://catalogimages.wiley.com/images/db/jimages/9781118356937.jpg
John Wiley http://dx.doi.org/10.1002/9781118936733
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7. 
Cover image for VLSI-SoC: From Algorithms to Circuits and System-on-Chip Design 20th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2012, Santa Cruz, CA, USA, October 7-10, 2012, Revised Selected Papers
VLSI-SoC: From Algorithms to Circuits and System-on-Chip Design 20th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2012, Santa Cruz, CA, USA, October 7-10, 2012, Revised Selected Papers
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Burg, Andreas. editor. Coṣkun, Ayṣe. editor. Guthaus, Matthew. editor. Katkoori, Srinivas. editor. Reis, Ricardo. editor.
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ONLINE(335188.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-45073-0
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8. 
Cover image for Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
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Li, Er-Ping. Wiley InterScience (Online service)
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IEEEXplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551
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9. 
Cover image for Integration of distributed generation in the power system
Integration of distributed generation in the power system
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Bollen, Math H. J., 1960-
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IEEE Xplore http://ieeexplore.ieee.org/servlet/opac?bknumber=6047601
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10. 
Cover image for Three Dimensional System Integration IC Stacking Process and Design
Three Dimensional System Integration IC Stacking Process and Design
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Papanikolaou, Antonis. editor. Soudris, Dimitrios. editor. Radojcic, Riko. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0962-6
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11. 
Cover image for Multiprocessor System-on-Chip Hardware Design and Tool Integration
Multiprocessor System-on-Chip Hardware Design and Tool Integration
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Hübner, Michael. editor. Becker, Jürgen. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-6460-1
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12. 
Cover image for Electromagnetic Compatibility for Device Design and System Integration
Electromagnetic Compatibility for Device Design and System Integration
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Gonschorek, Karl-Heinz. author. Vick, Ralf. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-03290-5
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