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1. 
Cover image for Advanced electronic packaging
Advanced electronic packaging
Author 
Brown, William D., 1943- Ulrich, Richard K. (Richard Kevin), 1955-
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2. 
Cover image for Advanced electronic packaging
Advanced electronic packaging
Author 
Ulrich, Richard K. (Richard Kevin), 1955- Brown, William D., 1943-
Preferred Shelf Number 
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Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522
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3. 
Cover image for The electronic packaging handbook
The electronic packaging handbook
Author 
Blackwell, Glenn R.
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4. 
Cover image for Nano-Bio- Electronic, Photonic and MEMS Packaging
Nano-Bio- Electronic, Photonic and MEMS Packaging
Author 
Wong, C.P. editor. Moon, Kyoung-Sik. editor. Li, Yi (Grace). editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0040-1
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5. 
Cover image for Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging
Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging
Author 
Gerlach, Gerald. editor. Wolter, Klaus-Jürgen. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-28522-6
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6. 
Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1053-9
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7. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7759-5
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8. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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9. 
Cover image for Electronic enclosures, housings and packages
Electronic enclosures, housings and packages
Author 
Süli, Frank, author.
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Electronic Access 
ScienceDirect https://www.sciencedirect.com/science/book/9780081023914
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10. 
Cover image for Extreme environment electronics
Extreme environment electronics
Author 
Cressler, John D. Mantooth, H. Alan, 1963-
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11. 
Cover image for Hermeticity of electronic packages
Hermeticity of electronic packages
Author 
Greenhouse, Hal. Lowry, Robert (Robert K.), 1944- Romenesko, Bruce.
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Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9781437778779
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12. 
Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes
MEMS/MOEMS packaging concepts, designs, materials, and processes
Author 
Gilleo, Ken.
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