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1. 
Cover image for The fields of electronics understanding electronics using basic physics
The fields of electronics understanding electronics using basic physics
Author 
Morrison, Ralph. Wiley InterScience (Online service)
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ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/0471433934
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2. 
Cover image for Process Technology for Silicon Carbide Devices
Process Technology for Silicon Carbide Devices
Author 
Zetterling, Carl-Mikael, ed.
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ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBEP002E
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3. 
Cover image for Direct-write technologies for rapid prototyping applications sensors, electronics, and integrated power sources
Direct-write technologies for rapid prototyping applications sensors, electronics, and integrated power sources
Author 
Piqué, Alberto. Chrisey, Douglas B.
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ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780121742317
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4. 
Cover image for Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Author 
Lee, Ning-Cheng.
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ONLINE
Electronic Access 
Volltext http://www.sciencedirect.com/science/book/9780750672184
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