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1. 
Cover image for Dynamical properties of solids
Dynamical properties of solids
Author 
Horton, George K., ed. Maradudin, A. A., ed.
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QC 176.8.L3 D993 1974- V.1
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Beytepe Library~4
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2. 
Cover image for Into the Nano Era Moore’s Law Beyond Planar Silicon CMOS
Into the Nano Era Moore’s Law Beyond Planar Silicon CMOS
Author 
Huff, Howard R. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-74559-4
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3. 
Cover image for High-Efficient Low-Cost Photovoltaics Recent Developments
High-Efficient Low-Cost Photovoltaics Recent Developments
Author 
Petrova-Koch, Vesselinka. editor. Hezel, Rudolf. editor. Goetzberger, Adolf. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-79359-5
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4. 
Cover image for Extended Defects in Germanium Fundamental and Technological Aspects
Extended Defects in Germanium Fundamental and Technological Aspects
Author 
Claeys, Cor. editor. Simoen, Eddy. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-540-85614-6
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5. 
Cover image for Functional Thin Films and Nanostructures for Sensors Synthesis, Physics and Applications
Functional Thin Films and Nanostructures for Sensors Synthesis, Physics and Applications
Author 
Fortin, Jeffrey. editor. Zribi, Anis. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/b138612
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6. 
Cover image for Flexible Electronics Materials and Applications
Flexible Electronics Materials and Applications
Author 
Salleo, Alberto. editor. Wong, William S. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-74363-9
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7. 
Cover image for Advanced Batteries Materials Science Aspects
Advanced Batteries Materials Science Aspects
Author 
Huggins, Robert A. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-76424-5
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8. 
Cover image for Energy Harvesting Technologies
Energy Harvesting Technologies
Author 
Priya, Shashank. editor. Inman, Daniel J. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-76464-1
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9. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-78219-5
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10. 
Cover image for Device Applications of Silicon Nanocrystals and Nanostructures
Device Applications of Silicon Nanocrystals and Nanostructures
Author 
Koshida, Nobuyoshi. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-78689-6
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11. 
Cover image for Phase Change Materials
Phase Change Materials
Author 
Raoux, Simone. editor. Wuttig, Matthias. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-84874-7
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12. 
Cover image for Solder Joint Reliability Prediction for Multiple Environments
Solder Joint Reliability Prediction for Multiple Environments
Author 
Perkins, Andrew E. author. Sitaraman, Suresh K. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-79394-8
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