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1. 
Cover image for Microelectronic circuit design
Microelectronic circuit design
Author 
Jaeger, Richard C. Blalock, Travis N.
Preferred Shelf Number 
TK7874 J33 2011
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Beytepe Library~1
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2. 
Cover image for Microelectronic Systems Circuits, Systems and Applications
Microelectronic Systems Circuits, Systems and Applications
Author 
Heuberger, Albert. editor. Elst, Günter. editor. Hanke, Randolf. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-23071-4
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3. 
Cover image for Microelectronic Test Structures for CMOS Technology
Microelectronic Test Structures for CMOS Technology
Author 
Bhushan, Manjul. author. Ketchen, Mark B. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-9377-9
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4. 
Cover image for Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
Author 
Liu, S. (Sheng), 1963- Liu, Yong, 1962- Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
Wiley InterScience An electronic book accessible through the World Wide Web; click for information
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Online Library~1
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5. 
Cover image for 3D IC stacking technology
3D IC stacking technology
Author 
Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.
Preferred Shelf Number 
ONLINE
Electronic Access 
Subscription required
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6. 
Cover image for Introduction to microsystem packaging technology
Introduction to microsystem packaging technology
Author 
Jin, Yufeng. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-
Preferred Shelf Number 
ONLINE
Electronic Access 
Distributed by publisher. Purchase or institutional license may be required for access.
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7. 
Cover image for Quantum-well laser array packaging nanoscale packaging techniques
Quantum-well laser array packaging nanoscale packaging techniques
Author 
Tomm, Jens W. Jim�enez, J. (Juan)
Preferred Shelf Number 
ONLINE
Electronic Access 
Subscription required
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8. 
Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes
MEMS/MOEMS packaging concepts, designs, materials, and processes
Author 
Gilleo, Ken.
Preferred Shelf Number 
ONLINE
Electronic Access 
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