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Publication Date: 2012

Author

(2)

(2)

Wiley InterScience (Online service)

(2)

(1)

Baklanov, Mikhail.

(1)

Balasinki, Artur.

(1)

Chen, Kuan-Neng.

(1)

Crowley, Patrick, 1974-

(1)

(1)

Einspruch, Norman G.

(1)

Estay, Patricio Cortes.

(1)

Fisher, Dennis G., Ph. D.

(1)

Fitzpatrick, Dennis.

(1)

Friedman, Eby G.

(1)

(1)

(1)

(1)

Koester, Steven J.

(1)

(1)

(1)

(1)

Morrison, Ralph.

(1)

Razavi, Behzad.

(1)

Rodríguez Pérez, José.

(1)

(1)

Smoszna, Marek.

(1)

Tan, Chuan Seng.

(1)

(1)

Tu, Steve Hung-Lung.

(1)

(1)

(1)

Zschech, Ehrenfried.

(1)

Language

(20)

Subject

Electronic books.

(6)

Integrated circuits -- Design and construction.

(6)

Integrated circuits -- Very large scale integration -- Design and construction.

(3)

Three-dimensional integrated circuits.

(3)

Electric filters.

(2)

Integrated circuits -- Very large scale integration.

(2)

Integrated circuits.

(2)

Interconnects (Integrated circuit technology)

(2)

Signal processing -- Equipment and supplies.

(2)

Signal processing -- Mathematics.

(2)

Application-specific integrated circuits.

(1)

Communication -- Network analysis.

(1)

Computer input-output equipment.

(1)

Computer networks -- Equipment and supplies.

(1)

Computer storage devices.

(1)

Digital electronics.

(1)

Digital integrated circuits -- Design and construction.

(1)

Electric current converters -- Automatic control.

(1)

Electric driving -- Automatic control.

(1)

Electrical engineering.

(1)

Electronic analog computers -- Circuits.

(1)

Electronic circuit design.

(1)

Embedded computer systems -- Design and construction.

(1)

Embedded computer systems.

(1)

(1)

Frequency synthesizers.

(1)

Gallium arsenide semiconductors.

(1)

High performance computing.

(1)

Industrial efficiency.

(1)

Integrated circuits -- Computer simulation.

(1)

Integrated circuits -- Computer-aided design.

(1)

Integrated circuits -- Design and construction -- Cost control.

(1)

Integrated circuits -- Reliability.

(1)

Integrated circuits -- Ultra large scale integration.

(1)

Integrated circuits -- Very large scale integration -- Design.

(1)

Linear integrated circuits -- Design and construction.

(1)

Linear integrated circuits.

(1)

(1)

Metal oxide semiconductors -- Reliability.

(1)

Metal oxide semiconductors, Complementary.

(1)

Microprocessors.

(1)

Microwave integrated circuits.

(1)

Predictive control.

(1)

Radio circuits -- Design and construction.

(1)

Read-only memory.

(1)

Semiconductor industry -- Cost control.

(1)

Semiconductor wafers.

(1)

Semiconductors -- Design and construction.

(1)

Semiconductors -- Materials.

(1)

Semiconductors -- Reliability.

(1)

Synchronous circuits -- Design and construction.

(1)

TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- General.

(1)

TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- Integrated.

(1)

TECHNOLOGY & ENGINEERING / Microwaves

(1)

Three-dimensional imaging.

(1)

Three-dimensional integrated circuits -- Design and construction.

(1)

Timing circuits.

(1)

Very high speed integrated circuits.

(1)

Voltage regulators.

(1)

Material Type

Shelf Location

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Electronic Library

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1.

Cover image for Signal processing and integrated circuits

Signal processing and integrated circuits

Signal processing and integrated circuits

Author

Baher, H.

Preferred Shelf Number

TK5102.9 B353 2012

Format:

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Beytepe Library~1

Available:
Copies:

2.

Cover image for Signal processing and integrated circuits

Signal processing and integrated circuits

Signal processing and integrated circuits

Author

Baher, H.

Preferred Shelf Number

ONLINE

Electronic Access

Wiley InterScience An electronic book accessible through the World Wide Web; click for information
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=867632
http://site.ebrary.com/lib/alltitles/Doc?id=10538674

Format:

Availability

Online Library~1

Available:
Copies:

3.

Cover image for Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC

Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC

Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC

Author

Li, Er-Ping.

Preferred Shelf Number

TK7874.893 L53 2012

Format:

Availability

Beytepe Library~1

Available:
Copies:

4.

Cover image for Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC

Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC

Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC

Author

Li, Er-Ping. Wiley InterScience (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

IEEEXplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551

Format:

Availability

Online Library~1

Available:
Copies:

5.

Cover image for VLSI electronics microstructure science

VLSI electronics microstructure science

VLSI electronics microstructure science

Author

Einspruch, Norman G.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9780122341236

Format:

Availability

Online Library~1

Available:
Copies:

6.

Cover image for Gallium arsenide IC applications handbook

Gallium arsenide IC applications handbook

Gallium arsenide IC applications handbook

Author

Fisher, Dennis G., Ph. D. Bahl, I. J.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9780122577352

Format:

Availability

Online Library~1

Available:
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7.

Cover image for Network processor design issues and practices

Network processor design issues and practices

Network processor design issues and practices

Author

Crowley, Patrick, 1974-

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9781558608757

Format:

Availability

Online Library~1

Available:
Copies:

8.

Cover image for Advanced Model Order Reduction Techniques in VLSI Design

Advanced Model Order Reduction Techniques in VLSI Design

Advanced Model Order Reduction Techniques in VLSI Design

Author

Tan, Sheldon. He, Lei.

Preferred Shelf Number

ONLINE

Electronic Access

Access by subscription

Format:

Availability

Online Library~1

Available:
Copies:

9.

Cover image for Analog Circuit Design for Communication SOC

Analog Circuit Design for Communication SOC

Analog Circuit Design for Communication SOC

Author

Tu, Steve Hung-Lung.

Preferred Shelf Number

ONLINE

Electronic Access

EBSCOhost http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=500547

Format:

Availability

Online Library~1

Available:
Copies:

10.

Cover image for Digital circuit boards mach 1 ghz

Digital circuit boards mach 1 ghz

Digital circuit boards mach 1 ghz

Author

Morrison, Ralph.

Preferred Shelf Number

ONLINE

Electronic Access

Connect to MyiLibrary resource.
Available by subscription from Safari Books Online
John Wiley http://dx.doi.org/10.1002/9781118278123
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=836591
ebrary http://site.ebrary.com/id/10630495

Format:

Availability

Online Library~1

Available:
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11.

Cover image for RF microelectronics

RF microelectronics

RF microelectronics

Author

Razavi, Behzad.

Preferred Shelf Number

TK6560 R278 2012

Format:

Availability

Beytepe Library~2

Available:
Copies:

12.

Cover image for 3D integration for VLSI systems

3D integration for VLSI systems

3D integration for VLSI systems

Author

Tan, Chuan Seng. Chen, Kuan-Neng. Koester, Steven J.

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

Format:

Availability

Online Library~1

Available:
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