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Cover image for Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author 
Li, Er-Ping.
Preferred Shelf Number 
TK7874.893 L53 2012
Format: 
Availability 
Beytepe Library~1
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2. 
Cover image for Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author 
Li, Er-Ping. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEEXplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551
Format: 
Availability 
Online Library~1
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3. 
Cover image for Philosophy and Cognitive Science Western & Eastern Studies
Philosophy and Cognitive Science Western & Eastern Studies
Author 
Magnani, Lorenzo. editor. Li, Ping. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-29928-5
Format: 
Availability 
Online Library~1
Available:
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