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1. 
Cover image for Semiconductor strain metrology principles and applications
Semiconductor strain metrology principles and applications
Author 
Wong, Terence K. S.
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EBSCOhost http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=500610
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2. 
Cover image for Through-silicon vias for 3D integration
Through-silicon vias for 3D integration
Author 
Lau, John.
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3. 
Cover image for CMOS voltage references an analytical and practical perspective
CMOS voltage references an analytical and practical perspective
Author 
Kok, Chi-Wah. Tam, Wing-Shan.
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IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6462190
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4. 
Cover image for Nano-CMOS gate dielectric engineering
Nano-CMOS gate dielectric engineering
Author 
Wong, Hei.
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