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1. 
Cover image for Polymers for packaging applications
Polymers for packaging applications
Author 
Alavi, Sajid, editor. Thomas, Sabu, editor. Sandeep, K. P., editor. Kalarikkal, Nandakumar, editor. Varghese, Jini, editor.
Preferred Shelf Number 
TA455 .P58 P65 2015
Electronic Access 
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2. 
Cover image for Functional polymers in food science : from technology to biology. Volume 1, Food packaging
Functional polymers in food science : from technology to biology. Volume 1, Food packaging
Author 
Cirillo, Giuseppe, 1980- editor. Spizzirri, Umile Gianfranco, editor. Iemma, Francesca, editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
Wiley Online Library
Format: 
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3. 
Cover image for Aseptic processing and packaging of food products
Aseptic processing and packaging of food products
Author 
Holdworth, S. D.
Preferred Shelf Number 
TP 371.2 H65 1992
Format: 
Availability 
Beytepe Library~1
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4. 
Cover image for Manufacturing flexible packaging : materials, machinery, and techniques
Manufacturing flexible packaging : materials, machinery, and techniques
Author 
Dunn, Thomas, author.
Preferred Shelf Number 
ONLINE(355523.1)
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780323264365
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5. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-25376-8
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6. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-1556-9
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7. 
Cover image for Enhancing Synergies in a Collaborative Environment
Enhancing Synergies in a Collaborative Environment
Author 
Cortés, Pablo. editor. Maeso-González, Elvira. editor. Escudero-Santana, Alejandro. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-14078-0
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8. 
Cover image for CAD, 3D Modeling, Engineering Analysis, and Prototype Experimentation Industrial and Research Applications
CAD, 3D Modeling, Engineering Analysis, and Prototype Experimentation Industrial and Research Applications
Author 
Zheng Li, Jeremy. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-05921-1
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9. 
Cover image for HTML5 Game Engines
HTML5 Game Engines
Author 
Nagle, Dan, author. Safari, an O'Reilly Media Company.
Preferred Shelf Number 
QA76.76 .C672
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9780429167676
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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10. 
Cover image for Industrial Engineering, Management Science and Applications 2015
Industrial Engineering, Management Science and Applications 2015
Author 
Gen, Mitsuo. editor. Kim, Kuinam J. editor. Huang, Xiaoxia. editor. Hiroshi, Yabe. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-662-47200-2
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11. 
Cover image for Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures
Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures
Author 
Voyiadjis, George Z. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-5589-9
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12. 
Cover image for Lyophilized Biologics and Vaccines Modality-Based Approaches
Lyophilized Biologics and Vaccines Modality-Based Approaches
Author 
Varshney, Dushyant. editor. Singh, Manmohan. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-2383-0
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