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Cover image for Data Management on New Hardware 7th International Workshop on Accelerating Data Analysis and Data Management Systems Using Modern Processor and Storage Architectures, ADMS 2016 and 4th International Workshop on In-Memory Data Management and Analytics, IMDM 2016, New Delhi, India, September 1, 2016, Revised Selected Papers
Data Management on New Hardware 7th International Workshop on Accelerating Data Analysis and Data Management Systems Using Modern Processor and Storage Architectures, ADMS 2016 and 4th International Workshop on In-Memory Data Management and Analytics, IMDM 2016, New Delhi, India, September 1, 2016, Revised Selected Papers
Author 
Blanas, Spyros. editor. Bordawekar, Rajesh. editor. Lahiri, Tirthankar. editor. Levandoski, Justin. editor. Pavlo, Andrew. editor.
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Electronic Access 
https://doi.org/10.1007/978-3-319-56111-0
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2. 
Cover image for Embedded Software Verification and Debugging
Embedded Software Verification and Debugging
Author 
Lettnin, Djones. editor. Winterholer, Markus. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-2266-2
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3. 
Cover image for Scaling OpenMP for Exascale Performance and Portability 13th International Workshop on OpenMP, IWOMP 2017, Stony Brook, NY, USA, September 20-22, 2017, Proceedings
Scaling OpenMP for Exascale Performance and Portability 13th International Workshop on OpenMP, IWOMP 2017, Stony Brook, NY, USA, September 20-22, 2017, Proceedings
Author 
de Supinski, Bronis R. editor. Olivier, Stephen L. editor. Terboven, Christian. editor. Chapman, Barbara M. editor. Müller, Matthias S. editor.
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https://doi.org/10.1007/978-3-319-65578-9
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4. 
Cover image for Green IT Engineering: Concepts, Models, Complex Systems Architectures
Green IT Engineering: Concepts, Models, Complex Systems Architectures
Author 
Kharchenko, Vyacheslav. editor. Kondratenko, Yuriy. editor. Kacprzyk, Janusz. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-44162-7
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5. 
Cover image for Electromigration Inside Logic Cells Modeling, Analyzing and Mitigating Signal Electromigration in NanoCMOS
Electromigration Inside Logic Cells Modeling, Analyzing and Mitigating Signal Electromigration in NanoCMOS
Author 
Posser, Gracieli. author. Sapatnekar, Sachin S. author. Reis, Ricardo. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-48899-8
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6. 
Cover image for Introduction to Logic Circuits & Logic Design with VHDL
Introduction to Logic Circuits & Logic Design with VHDL
Author 
LaMeres, Brock J. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-34195-8
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7. 
Cover image for More-than-Moore 2.5D and 3D SiP Integration
More-than-Moore 2.5D and 3D SiP Integration
Author 
Radojcic, Riko. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-52548-8
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8. 
Cover image for Hardware IP Security and Trust
Hardware IP Security and Trust
Author 
Mishra, Prabhat. editor. Bhunia, Swarup. editor. Tehranipoor, Mark. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-49025-0
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9. 
Cover image for Foundations of Hardware IP Protection
Foundations of Hardware IP Protection
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Bossuet, Lilian. editor. Torres, Lionel. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-50380-6
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10. 
Cover image for Fundamentals of IP and SoC Security Design, Verification, and Debug
Fundamentals of IP and SoC Security Design, Verification, and Debug
Author 
Bhunia, Swarup. editor. Ray, Sandip. editor. Sur-Kolay, Susmita. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-50057-7
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11. 
Cover image for Internet of Things Building Blocks and Business Models
Internet of Things Building Blocks and Business Models
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Hussain, Fatima. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-55405-1
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12. 
Cover image for Emerging Technology and Architecture for Big-data Analytics
Emerging Technology and Architecture for Big-data Analytics
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Chattopadhyay, Anupam. editor. (orcid)0000-0002-8818-6983 Chang, Chip Hong. editor. Yu, Hao. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-54840-1
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