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Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-77872-3
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2. 
Cover image for Product training for the technical expert : the art of developing and delivering hands-on learning
Product training for the technical expert : the art of developing and delivering hands-on learning
Author 
Bixby, Daniel W., 1972- author.
Preferred Shelf Number 
TT165 .B59 2018
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119260325
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3. 
Cover image for SME internationalization strategies : innovation to conquer new markets
SME internationalization strategies : innovation to conquer new markets
Author 
Dominguez, Noémie.
Preferred Shelf Number 
HD2341
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119453413
Format: 
Availability 
Online Library~1
Available:
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