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1. 
Cover image for Oscillator design and computer simulation
Oscillator design and computer simulation
Author 
Rhea, Randall W.
Preferred Shelf Number 
TK 7872.O7 R54 1995
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2. 
Cover image for Comprehensive Healthcare Simulation: Pharmacy Education, Practice and Research
Comprehensive Healthcare Simulation: Pharmacy Education, Practice and Research
Author 
Al-Worafi, Yaser Mohammed. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-33761-1
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3. 
Cover image for Body of Knowledge for Modeling and Simulation A Handbook by the Society for Modeling and Simulation International
Body of Knowledge for Modeling and Simulation A Handbook by the Society for Modeling and Simulation International
Author 
Ören, Tuncer. editor. Zeigler, Bernard P. editor. Tolk, Andreas. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-11085-6
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4. 
Cover image for Computational modelling and simulation of aircraft and the environment
Computational modelling and simulation of aircraft and the environment
Author 
Diston, Dominic J.
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ONLINE
Electronic Access 
Books24x7 http://www.books24x7.com/marc.asp?bookid=33686
John Wiley http://dx.doi.org/10.1002/9780470744130
http://site.ebrary.com/lib/alltitles/Doc?id=10313614
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5. 
Cover image for Selected Sensor Circuits From Data Sheet to Simulation
Selected Sensor Circuits From Data Sheet to Simulation
Author 
Baumann, Peter. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-658-38212-4
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6. 
Cover image for Simulation and Modeling Methodologies, Technologies and Applications International Online Conference (SIMULTECH 2021)
Simulation and Modeling Methodologies, Technologies and Applications International Online Conference (SIMULTECH 2021)
Author 
Wagner, Gerd. editor. Werner, Frank. editor. Oren, Tuncer. editor. De Rango, Floriano. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-23149-0
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7. 
Cover image for Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Author 
del Giudice, Davide. author. Bizzarri, Federico. author. Linaro, Daniele. author. Brambilla, Angelo Maurizio. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-12818-9
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8. 
Cover image for Advances in Design, Simulation and Manufacturing VI Proceedings of the 6th International Conference on Design, Simulation, Manufacturing: The Innovation Exchange, DSMIE-2023, June 6-9, 2023, High Tatras, Slovak Republic - Volume 2: Mechanical and Materials Engineering
Advances in Design, Simulation and Manufacturing VI Proceedings of the 6th International Conference on Design, Simulation, Manufacturing: The Innovation Exchange, DSMIE-2023, June 6-9, 2023, High Tatras, Slovak Republic - Volume 2: Mechanical and Materials Engineering
Author 
Ivanov, Vitalii. editor. (orcid)0000-0003-0595-2660 Pavlenko, Ivan. editor. Liaposhchenko, Oleksandr. editor. Machado, José. editor. Edl, Milan. editor. (orcid)0000-0003-0761-7882
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ONLINE
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https://doi.org/10.1007/978-3-031-32774-2
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9. 
Cover image for Machine Learning in Modeling and Simulation Methods and Applications
Machine Learning in Modeling and Simulation Methods and Applications
Author 
Rabczuk, Timon. editor. Bathe, Klaus-Jürgen. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-36644-4
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10. 
Cover image for Large-Eddy Simulation Based on the Lattice Boltzmann Method for Built Environment Problems
Large-Eddy Simulation Based on the Lattice Boltzmann Method for Built Environment Problems
Author 
Han, Mengtao. author. Ooka, Ryozo. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-1264-3
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11. 
Cover image for Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Author 
Wu, Yongle. author. Wang, Weimin. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-1455-5
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12. 
Cover image for The Future of Heritage Science and Technologies Design, Simulation and Monitoring
The Future of Heritage Science and Technologies Design, Simulation and Monitoring
Author 
Furferi, Rocco. editor. Governi, Lapo. editor. Volpe, Yary. editor. Gherardini, Francesco. editor. (orcid)0000-0002-9275-4314 Seymour, Kate. editor.
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ONLINE
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https://doi.org/10.1007/978-3-031-17594-7
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