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1. 
Cover image for VLSI electronics microstructure science
VLSI electronics microstructure science
Author 
Einspruch, Norman G.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780122341236
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2. 
Cover image for Parallel distributed processing : explorations in the microstructure of cognition
Parallel distributed processing : explorations in the microstructure of cognition
Author 
Rumelhart, David E. McClelland, James L., ort. yaz. University of California, San Diego. PDP Research Group.
Preferred Shelf Number 
BF 455 R853 1986 V.1
Format: 
Availability 
Beytepe Library~2
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3. 
Cover image for Silicon molecular beam epitaxy proceedings of the 3rd International Symposium on Silicon Molecular Beam Epitaxy, Symposium A of the 1989 E-MRS Conference, Strasbourg, France, 30 May-2 June 1989
Silicon molecular beam epitaxy proceedings of the 3rd International Symposium on Silicon Molecular Beam Epitaxy, Symposium A of the 1989 E-MRS Conference, Strasbourg, France, 30 May-2 June 1989
Author 
International Symposium on Silicon Molecular Beam Epitaxy (3rd : 1989 : Strasbourg, France) Kasper, Erich. Parker, E. H. C. European Materials Research Society.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780444886200
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4. 
Cover image for Dynamics and transport in macromolecular networks : theory, modelling, and experiments
Dynamics and transport in macromolecular networks : theory, modelling, and experiments
Author 
YAN, L-T.
Preferred Shelf Number 
QH324.2 .D963 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527839568
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5. 
Cover image for Digital materials : continuum numerical methods at the mesoscopic scale
Digital materials : continuum numerical methods at the mesoscopic scale
Author 
Bernacki, Marc, editor. Forest, Samuel, editor.
Preferred Shelf Number 
QC173.454 .G54 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394332489
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6. 
Cover image for Solid-state metal additive manufacturing : physics, processes, mechanical properties, and applications
Solid-state metal additive manufacturing : physics, processes, mechanical properties, and applications
Author 
Yu, Hang Z. editor Tuncer, Nihan, editor Feng, Zhili, editor.
Preferred Shelf Number 
TS183.25
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527839353
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7. 
Cover image for Smart materials for science and engineering
Smart materials for science and engineering
Author 
Upēndra Kumār, editor. Sonkar, Piyush Kumar, 1989- editor.
Preferred Shelf Number 
TA418.9 .S62 S53 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394186488
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8. 
Cover image for Metallic powders for additive manufacturing : science and applications
Metallic powders for additive manufacturing : science and applications
Author 
Lavernia, Enrique J., author. Ma, Kaka, author. Schoenung, Julie M., author. Shackelford, James F., author. Zheng, Baolong, author.
Preferred Shelf Number 
TS183.25
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119908142
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9. 
Cover image for Thermal management materials for electronic packaging : preparation, characterization, and devices
Thermal management materials for electronic packaging : preparation, characterization, and devices
Author 
Tian, Xingyou, editor.
Preferred Shelf Number 
TK7870.15
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527843121
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10. 
Cover image for Electroceramics for high performance supercapacitors
Electroceramics for high performance supercapacitors
Author 
Inamuddin, 1980- editor. Altalhi, Tariq, editor. Adnan, Sayed Mohammed, editor.
Preferred Shelf Number 
TK7872 .C65 E44 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394167166
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