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1. 
Cover image for Analog Microelectronics
Analog Microelectronics
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Borgarino, Mattia. author. (orcid)0000-0001-9678-592X SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-94286-0
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Cover image for Reliability prediction for microelectronics
Reliability prediction for microelectronics
Author 
Bernstein, Joseph B., author. Bensoussan, Alain A., author. Bender, Emmanuel (Carl), author.
Preferred Shelf Number 
TK7874
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https://onlinelibrary.wiley.com/doi/book/10.1002/9781394210961
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3. 
Cover image for RF and Microwave Microelectronics Packaging II
RF and Microwave Microelectronics Packaging II
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Kuang, Ken. editor. Sturdivant, Rick. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-51697-4
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4. 
Cover image for Microelectronics From Fundamentals to Applied Design
Microelectronics From Fundamentals to Applied Design
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Di Paolo Emilio, Maurizio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-22545-6
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5. 
Cover image for RF and Microwave Microelectronics Packaging
RF and Microwave Microelectronics Packaging
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Kuang, Ken. editor. Kim, Franklin. editor. Cahill, Sean S. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0984-8
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6. 
Cover image for Advances in Micro-Electronics, Embedded Systems and IoT Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 1
Advances in Micro-Electronics, Embedded Systems and IoT Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 1
Author 
Bhateja, Vikrant. editor. Anguera, Jaume. editor. Ghosh, Anumoy. editor. (orcid)0000-0003-4865-5893 Chowdary, P. Satish Rama. editor. (orcid)0000-0002-1649-4258 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-7222-6
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7. 
Cover image for Advancements in VLSI Design, Microelectronics Devices and Circuits Select Proceedings of SPIN 2025, Volume 5
Advancements in VLSI Design, Microelectronics Devices and Circuits Select Proceedings of SPIN 2025, Volume 5
Author 
Kumar, Pradeep. editor. Navaraj, William. editor. Moreira, Fernando. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-9231-6
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8. 
Cover image for Micro-electronics and Telecommunication Engineering Proceedings of 8th ICMETE 2024
Micro-electronics and Telecommunication Engineering Proceedings of 8th ICMETE 2024
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Mahapatra, Rajendra Prasad. editor. Singh, Rupali. editor. Mishra, Sukumar. editor. Gupta, Saptarshi. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-6515-0
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9. 
Cover image for Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 3
Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 3
Author 
Bhateja, Vikrant. editor. Omar, Zaid. editor. Ghosh, Anumoy. editor. (orcid)0000-0003-4865-5893 Shrivastava, Sarika. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-7249-3
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10. 
Cover image for Signal Processing, Telecommunication and Embedded Systems: Automation and Sustainability Applications Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 4
Signal Processing, Telecommunication and Embedded Systems: Automation and Sustainability Applications Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 4
Author 
Bhateja, Vikrant. editor. Flores-Fuentes, Wendy. editor. (orcid)0000-0002-1477-7449 Bhattacharya, Anagha. editor. Chowdary, P. Satish Rama. editor. (orcid)0000-0002-1649-4258 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-7253-0
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11. 
Cover image for Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)
Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)
Author 
Bhateja, Vikrant. editor. Chakravarthy, V. V. S. S. S. editor. Anguera, Jaume. editor. Ghosh, Anumoy. editor. (orcid)0000-0003-4865-5893 Flores Fuentes, Wendy. editor. (orcid)0000-0002-1477-7449
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https://doi.org/10.1007/978-981-97-8422-6
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12. 
Cover image for Evolution in Signal Processing and Telecommunication Networks Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)
Evolution in Signal Processing and Telecommunication Networks Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)
Author 
Bhateja, Vikrant. editor. (orcid)0000-0002-3259-8874 Chowdary, P. Satish Rama. editor. (orcid)0000-0002-1649-4258 Flores-Fuentes, Wendy. editor. (orcid)0000-0002-1477-7449 Urooj, Shabana. editor. (orcid)0000-0002-1477-8759 Sankar Dhar, Rudra. editor. (orcid)0000-0002-6571-3808
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https://doi.org/10.1007/978-981-97-0644-0
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