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1. 
Cover image for Nanoparticle engineering for chemical-mechanical planarization : fabrication of next-generation nanodevices
Nanoparticle engineering for chemical-mechanical planarization : fabrication of next-generation nanodevices
Author 
Paik, Ungyu. Park, Jea-Gun.
Preferred Shelf Number 
TK7874.84
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9780429291890
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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2. 
Cover image for Advances in chemical mechanical planarization (CMP)
Advances in chemical mechanical planarization (CMP)
Author 
Babu, S. V., editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780081001653
Format: 
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3. 
Cover image for Microelectronic applications of chemical mechanical planarization
Microelectronic applications of chemical mechanical planarization
Author 
Li, Yuzhuo. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
Contributor biographical information http://catdir.loc.gov/catdir/enhancements/fy0742/2007015557-b.html
John Wiley http://dx.doi.org/10.1002/9780470180907
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4. 
Cover image for Chemical mechanical planarization of microelectronic materials
Chemical mechanical planarization of microelectronic materials
Author 
Steigerwald, Joseph M. Murarka, S. P. Gutmann, Ronald J. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527617746
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley041/96006198.html
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