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1. 
Cover image for Modeling and Application of Flexible Electronics Packaging
Modeling and Application of Flexible Electronics Packaging
Author 
Huang, YongAn. author. Yin, Zhouping. author. Wan, Xiaodong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-13-3627-0
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2. 
Cover image for Electronics Process Technology Production Modelling, Simulation and Optimisation
Electronics Process Technology Production Modelling, Simulation and Optimisation
Author 
Sauer, Wilfried. author. Oppermann, Martin. author. Werner, Sebastian. author. Wohlrabe, Heinz. author. Zerna, Thomas. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-84628-354-X
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3. 
Cover image for Systems modeling and computer simulation
Systems modeling and computer simulation
Author 
Kheir, Naim A., 1933- ed.
Preferred Shelf Number 
QA 76.9.C65 S975 1996
Format: 
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Beytepe Library~1
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4. 
Cover image for Computational Methods in Power System Analysis
Computational Methods in Power System Analysis
Author 
Idema, Reijer. author. Lahaye, Domenico J.P. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.2991/978-94-6239-064-5
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5. 
Cover image for Photovoltaic Sources Modeling and Emulation
Photovoltaic Sources Modeling and Emulation
Author 
Di Piazza, Maria Carmela. author. Vitale, Gianpaolo. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330965.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4471-4378-9
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6. 
Cover image for Mechatronic Systems Analysis, Design and Implementation
Mechatronic Systems Analysis, Design and Implementation
Author 
Boukas, El-Kébir. author. AL-Sunni, Fouad M. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-22324-2
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7. 
Cover image for Precision Assembly Technologies and Systems 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Chamonix, France, February 12-15, 2012. Proceedings
Precision Assembly Technologies and Systems 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Chamonix, France, February 12-15, 2012. Proceedings
Author 
Ratchev, Svetan. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-28163-1
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8. 
Cover image for Nonsmooth Modeling and Simulation for Switched Circuits
Nonsmooth Modeling and Simulation for Switched Circuits
Author 
Acary, Vincent. author. Bonnefon, Olivier. author. Brogliato, Bernard. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-90-481-9681-4
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9. 
Cover image for Precision Assembly Technologies and Systems 5th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2010, Chamonix, France, February 14-17, 2010. Proceedings
Precision Assembly Technologies and Systems 5th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2010, Chamonix, France, February 14-17, 2010. Proceedings
Author 
Ratchev, Svetan. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-11598-1
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10. 
Cover image for Languages for Embedded Systems and their Applications Selected Contributions on Specification, Design, and Verification from FDL’08
Languages for Embedded Systems and their Applications Selected Contributions on Specification, Design, and Verification from FDL’08
Author 
Radetzki, Martin. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-9714-0
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11. 
Cover image for Simulation of Semiconductor Processes and Devices 2007 SISPAD 2007
Simulation of Semiconductor Processes and Devices 2007 SISPAD 2007
Author 
Grasser, Tibor. editor. Selberherr, Siegfried. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-211-72861-1
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12. 
Cover image for Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms
Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms
Author 
Kogel, Tim. author. Leupers, Rainer. author. Meyr, Heinrich. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-4020-4826-2
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