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1. 
Cover image for Low-Power VLSI Circuits and Systems
Low-Power VLSI Circuits and Systems
Author 
Pal, Ajit. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-81-322-1937-8
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2. 
Cover image for Interconnect Reliability in Advanced Memory Device Packaging
Interconnect Reliability in Advanced Memory Device Packaging
Author 
Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-26708-6
Format: 
Availability 
Online Library~1
Available:
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