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1. 
Cover image for High Dielectric Constant Materials VLSI MOSFET Applications
High Dielectric Constant Materials VLSI MOSFET Applications
Author 
Huff, H.R. editor. Gilmer, D.C. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b137574
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2. 
Cover image for System-level Test and Validation of Hardware/Software Systems
System-level Test and Validation of Hardware/Software Systems
Author 
Sonza Reorda, Matteo. editor. Peng, Zebo. editor. Violante, Massimo. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-84628-145-8
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3. 
Cover image for Copper Electrodeposition for Nanofabrication of Electronics Devices
Copper Electrodeposition for Nanofabrication of Electronics Devices
Author 
Kondo, Kazuo. editor. Akolkar, Rohan N. editor. Barkey, Dale P. editor. Yokoi, Masayuki. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9176-7
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4. 
Cover image for Lattice engineering technology and applications
Lattice engineering technology and applications
Author 
Wang, Shumin.
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Distributed by publisher. Purchase or institutional license may be required for access.
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