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1. 
Cover image for Interdisciplinary Technological Advancements in Smart Cities
Interdisciplinary Technological Advancements in Smart Cities
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Abougreen, Arij Naser. editor. Mehta, Shilpa. editor. Costa, Cristina. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-69441-7
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Cover image for Proceedings of Ninth International Congress on Information and Communication Technology ICICT 2024, London, Volume 9
Proceedings of Ninth International Congress on Information and Communication Technology ICICT 2024, London, Volume 9
Author 
Yang, Xin-She. editor. Sherratt, R. Simon. editor. Dey, Nilanjan. editor. Joshi, Amit. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-5035-1
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Cover image for Data Science and Network Engineering Proceedings ICDSNE 2024
Data Science and Network Engineering Proceedings ICDSNE 2024
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Namasudra, Suyel. editor. Kar, Nirmalya. editor. (orcid)0000-0002-7371-232X Patra, Sarat Kumar. editor. Taniar, David. editor. (orcid)0000-0002-8862-3960 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-8336-6
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Cover image for Safety-Centric Operations Research: Innovations and Integrative Approaches A Multidisciplinary Approach to Managing Risk in Complex Systems
Safety-Centric Operations Research: Innovations and Integrative Approaches A Multidisciplinary Approach to Managing Risk in Complex Systems
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Yazdi, Mohammad. editor. (orcid)0000-0002-6714-5285 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-82934-5
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5. 
Cover image for EAI 3rd International Conference on Smart Technologies and Innovation Management MTYMEX 2024
EAI 3rd International Conference on Smart Technologies and Innovation Management MTYMEX 2024
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Taherdoost, Hamed. editor. (orcid)0000-0002-6503-6739 Farhaoui, Yousef. editor. Shahamiri, Seyed Reza. editor. Le, Tuan-Vinh. editor. Madanchian, Mitra. editor.
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https://doi.org/10.1007/978-3-031-64957-8
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6. 
Cover image for Project Management in Cloud and IoT Applications
Project Management in Cloud and IoT Applications
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Bhatt, Pramod Chandra P. author. Sehgal, Naresh Kumar. author. Castro, Richard. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-99427-2
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7. 
Cover image for Fundamentals of 6G Communications and Networking
Fundamentals of 6G Communications and Networking
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Lin, Xingqin. editor. Zhang, Jun. editor. (orcid)0000-0002-5222-1898 Liu, Yuanwei. editor. (orcid)0000-0002-6389-8941 Kim, Joongheon. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-37920-8
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8. 
Cover image for Product Lifecycle Management (Volume 2) The Devil is in the Details
Product Lifecycle Management (Volume 2) The Devil is in the Details
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Stark, John. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-50658-1
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Cover image for Proceedings of the 6th International Conference on Communications and Cyber Physical Engineering ICCCE 2023; 28-29 April, Hyderabad, India
Proceedings of the 6th International Conference on Communications and Cyber Physical Engineering ICCCE 2023; 28-29 April, Hyderabad, India
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Kumar, Amit. editor. Mozar, Stefan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-7137-4
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10. 
Cover image for Information Technology Security Modern Trends and Challenges
Information Technology Security Modern Trends and Challenges
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Gountia, Debasis. editor. (orcid)0000-0002-9079-1074 Dalei, Dilip Kumar. editor. Mishra, Subhankar. editor. (orcid)0000-0002-9910-7291 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-0407-1
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11. 
Cover image for Smart Mobile Communication & Artificial Intelligence Proceedings of the 15th IMCL Conference - Volume 2
Smart Mobile Communication & Artificial Intelligence Proceedings of the 15th IMCL Conference - Volume 2
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Auer, Michael E. editor. Tsiatsos, Thrasyvoulos. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-56075-0
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12. 
Cover image for Coupled Structures for Microwave Sensing
Coupled Structures for Microwave Sensing
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Martín, Ferran. editor. Bronchalo, Enrique. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-53861-2
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