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1. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
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Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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Cover image for Smart Systems Integration and Simulation
Smart Systems Integration and Simulation
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Bombieri, Nicola. editor. Poncino, Massimo. editor. Pravadelli, Graziano. editor. (orcid)0000-0002-7833-1673 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-27392-1
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Cover image for Silicon Components and Processes Self Study Unit Processes and Process Integration
Silicon Components and Processes Self Study Unit Processes and Process Integration
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El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-59219-5
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Cover image for Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
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Hilleringmann, Ulrich. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-41041-4
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Cover image for More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
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Iacopi, Francesca. editor. Balestra, Francis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-21610-7
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Cover image for More-than-Moore 2.5D and 3D SiP Integration
More-than-Moore 2.5D and 3D SiP Integration
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Radojcic, Riko. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-52548-8
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Cover image for Computer-Aided Design of Microfluidic Very Large Scale Integration (mVLSI) Biochips Design Automation, Testing, and Design-for-Testability
Computer-Aided Design of Microfluidic Very Large Scale Integration (mVLSI) Biochips Design Automation, Testing, and Design-for-Testability
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Hu, Kai. author. Chakrabarty, Krishnendu. author. Ho, Tsung-Yi. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-56255-1
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Cover image for VLSI-SoC: System-on-Chip in the Nanoscale Era - Design, Verification and Reliability 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, Tallinn, Estonia, September 26-28, 2016, Revised Selected Papers
VLSI-SoC: System-on-Chip in the Nanoscale Era - Design, Verification and Reliability 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, Tallinn, Estonia, September 26-28, 2016, Revised Selected Papers
Author 
Hollstein, Thomas. editor. Raik, Jaan. editor. Kostin, Sergei. editor. Tšertov, Anton. editor. O'Connor, Ian. editor.
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https://doi.org/10.1007/978-3-319-67104-8
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9. 
Cover image for Microfluidic Very Large Scale Integration (VLSI) Modeling, Simulation, Testing, Compilation and Physical Synthesis
Microfluidic Very Large Scale Integration (VLSI) Modeling, Simulation, Testing, Compilation and Physical Synthesis
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Pop, Paul. author. Minhass, Wajid Hassan. author. Madsen, Jan. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-29599-2
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10. 
Cover image for VLSI-SoC: Design for Reliability, Security, and Low Power 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected Papers
VLSI-SoC: Design for Reliability, Security, and Low Power 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected Papers
Author 
Shin, Youngsoo. editor. Tsui, Chi Ying. editor. Kim, Jae-Joon. editor. Choi, Kiyoung. editor. Reis, Ricardo. editor. (orcid)0000-0001-5781-5858
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11. 
Cover image for Hardware/Software Co-Design and Optimization for Cyberphysical Integration in Digital Microfluidic Biochips
Hardware/Software Co-Design and Optimization for Cyberphysical Integration in Digital Microfluidic Biochips
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Luo, Yan. author. Chakrabarty, Krishnendu. author. Ho, Tsung-Yi. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09006-1
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12. 
Cover image for Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2751-7
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