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1. 
Cover image for Circuit Design for Reliability
Circuit Design for Reliability
Author 
Reis, Ricardo. editor. Cao, Yu. editor. Wirth, Gilson. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-4078-9
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2. 
Cover image for Interconnect Reliability in Advanced Memory Device Packaging
Interconnect Reliability in Advanced Memory Device Packaging
Author 
Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-26708-6
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3. 
Cover image for Lifetime Reliability-aware Design of Integrated Circuits
Lifetime Reliability-aware Design of Integrated Circuits
Author 
Raji, Mohsen. author. Ghavami, Behnam. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-15345-7
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4. 
Cover image for Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-1-4939-2751-7
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5. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-9266-5
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6. 
Cover image for Software Defined Chips Volume II
Software Defined Chips Volume II
Author 
Liu, Leibo. author. Wei, Shaojun. author. Zhu, Jianfeng. author. Deng, Chenchen. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-7636-0
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7. 
Cover image for More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
Author 
Iacopi, Francesca. editor. Balestra, Francis. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-21610-7
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8. 
Cover image for Emerging Electronic Devices, Circuits and Systems Select Proceedings of EEDCS Workshop Held in Conjunction with ISDCS 2022
Emerging Electronic Devices, Circuits and Systems Select Proceedings of EEDCS Workshop Held in Conjunction with ISDCS 2022
Author 
Giri, Chandan. editor. Iizuka, Takahiro. editor. Rahaman, Hafizur. editor. Bhattacharya, Bhargab B. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0055-8
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9. 
Cover image for Micro-Relay Technology for Energy-Efficient Integrated Circuits
Micro-Relay Technology for Energy-Efficient Integrated Circuits
Author 
Kam, Hei. author. Chen, Fred. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-1-4939-2128-7
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10. 
Cover image for Spintronics-based Computing
Spintronics-based Computing
Author 
Zhao, Weisheng. editor. Prenat, Guillaume. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-15180-9
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11. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-25376-8
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12. 
Cover image for CMOS Test and Evaluation A Physical Perspective
CMOS Test and Evaluation A Physical Perspective
Author 
Bhushan, Manjul. author. Ketchen, Mark B. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-1349-7
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