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1. 
Cover image for Bias Temperature Instability for Devices and Circuits
Bias Temperature Instability for Devices and Circuits
Author 
Grasser, Tibor. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-1-4614-7909-3
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2. 
Cover image for Willemite-Based Glass Ceramic Doped by Different Percentage of Erbium Oxide and Sintered in Temperature of 500-1100C Physical and Optical Properties
Willemite-Based Glass Ceramic Doped by Different Percentage of Erbium Oxide and Sintered in Temperature of 500-1100C Physical and Optical Properties
Author 
Sarrigani, Gholamreza Vahedi. author. Amiri, Iraj Sadegh. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-10644-7
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3. 
Cover image for Temperature- and Supply Voltage-Independent Time References for Wireless Sensor Networks
Temperature- and Supply Voltage-Independent Time References for Wireless Sensor Networks
Author 
De Smedt, Valentijn. author. Gielen, Georges. author. Dehaene, Wim. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-09003-0
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4. 
Cover image for High-Z Materials for X-ray Detection Material Properties and Characterization Techniques
High-Z Materials for X-ray Detection Material Properties and Characterization Techniques
Author 
Abbene, Leonardo. editor. Iniewski, Krzysztof (Kris). editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-20955-0
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5. 
Cover image for Differentiated Layout Styles for MOSFETs Electrical Behavior in Harsh Environments
Differentiated Layout Styles for MOSFETs Electrical Behavior in Harsh Environments
Author 
Gimenez, Salvador Pinillos. author. Galembeck, Egon Henrique Salerno. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-29086-2
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6. 
Cover image for Advances in VLSI and Embedded Systems Select Proceedings of AVES 2021
Advances in VLSI and Embedded Systems Select Proceedings of AVES 2021
Author 
Darji, Anand D. editor. Joshi, Deepak. editor. Joshi, Amit. editor. Sheriff, Ray. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-6780-1
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7. 
Cover image for Biomedical Electronics, Noise Shaping ADCs, and Frequency References Advances in Analog Circuit Design 2022
Biomedical Electronics, Noise Shaping ADCs, and Frequency References Advances in Analog Circuit Design 2022
Author 
Harpe, Pieter. editor. Baschirotto, Andrea. editor. Makinwa, Kofi A.A. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-28912-5
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8. 
Cover image for Sensors and Microsystems Proceedings of AISEM 2022
Sensors and Microsystems Proceedings of AISEM 2022
Author 
Di Francia, Girolamo. editor. Di Natale, Corrado. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-25706-3
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9. 
Cover image for Interconnect Reliability in Advanced Memory Device Packaging
Interconnect Reliability in Advanced Memory Device Packaging
Author 
Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-26708-6
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10. 
Cover image for Design of Organic Complementary Circuits and Systems on Foil
Design of Organic Complementary Circuits and Systems on Foil
Author 
Abdinia, Sahel. author. van Roermund, Arthur. author. Cantatore, Eugenio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-21188-6
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11. 
Cover image for Thermal Effects in Supercapacitors
Thermal Effects in Supercapacitors
Author 
Xiong, Guoping. author. Kundu, Arpan. author. Fisher, Timothy S. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-20242-6
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12. 
Cover image for Hot Carrier Degradation in Semiconductor Devices
Hot Carrier Degradation in Semiconductor Devices
Author 
Grasser, Tibor. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08994-2
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