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Subject: Electronic packaging.

Author

Greenhouse, Hal.

(2)

Bath, Jasbir, editor.

(1)

Huang, Wei, editor.

(1)

(1)

Jamnia, Ali, 1961- author.

(1)

Licari, James J., 1930-

(1)

Lowry, Robert (Robert K.), 1944-

(1)

Meng, Hong, editor.

(1)

Nakamura, Shozo (Professor Emeritus), author.

(1)

Pengelly, Raymond S.

(1)

Puttlitz, Karl J.

(1)

Remsburg, Ralph., author.

(1)

Romenesko, Bruce.

(1)

Stalter, Kathleen A.

(1)

Suganuma, Katsuaki.

(1)

Swanson, Dale W.

(1)

Language

(12)

Publication Date

-

(2)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

Subject

Mise sous boîtier (Électronique)

(3)

Solder and soldering.

(3)

Electronic books.

(2)

Electronics -- Materials -- Permeability.

(2)

Microelectronics.

(2)

Sealing (Technology)

(2)

TECHNOLOGY & ENGINEERING.

(2)

(1)

Amplifiers (Electronics).

(1)

Chip scale packaging.

(1)

Conducting polymers.

(1)

Dichtung (Technik)

(1)

Electronic apparatus and appliances -- Design and construction.

(1)

Electronic apparatus and appliances -- Thermal properties.

(1)

Electronic packaging

(1)

Electronics -- Materials.

(1)

(1)

Elektronisches Bauelement.

(1)

Environmental protection.

(1)

Field-effect transistors.

(1)

Gallium arsenide.

(1)

Green products.

(1)

Heat -- Transmission.

(1)

Microwave transistors.

(1)

Mixing circuits.

(1)

Oscillators, Electric.

(1)

Polymères conducteurs.

(1)

Quality Control.

(1)

Semiconductors.

(1)

Solder and soldering

(1)

(1)

(1)

Material Type

Shelf Location

Electronic Library

Taylor Francis E-Book Collection

Wiley E-Book Collection

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1.

Cover image for PRACTICAL GUIDE FOR THE RELIABLE PACKAGING OF ELECTRONICS thermal and mechanical design and... analysis.

PRACTICAL GUIDE FOR THE RELIABLE PACKAGING OF ELECTRONICS thermal and mechanical design and... analysis.

PRACTICAL GUIDE FOR THE RELIABLE PACKAGING OF ELECTRONICS thermal and mechanical design and... analysis.

Author

JAMNIA, ALI.

Preferred Shelf Number

TK7870.15

Electronic Access

Taylor & Francis https://www.taylorfrancis.com/books/9781003564485
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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2.

Cover image for Practical guide to the packaging of electronics : thermal and mechanical design and analysis

Practical guide to the packaging of electronics : thermal and mechanical design and analysis

Practical guide to the packaging of electronics : thermal and mechanical design and analysis

Author

Jamnia, Ali, 1961- author.

Preferred Shelf Number

TK7870.15 .J36 2009

Electronic Access

Click here to view.

Format:

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3.

Cover image for Lead-free soldering in electronics : science, technology and environmental impact

Lead-free soldering in electronics : science, technology and environmental impact

Lead-free soldering in electronics : science, technology and environmental impact

Author

Suganuma, Katsuaki.

Preferred Shelf Number

TK7870.15 .L43 2004

Electronic Access

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4.

Cover image for Thermal design of electronic equipment

Thermal design of electronic equipment

Thermal design of electronic equipment

Author

Remsburg, Ralph., author.

Preferred Shelf Number

TK7870.25 .R46 2001

Electronic Access

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5.

Cover image for Flexible electronic packaging and encapsulation technology

Flexible electronic packaging and encapsulation technology

Flexible electronic packaging and encapsulation technology

Author

Meng, Hong, editor. Huang, Wei, editor.

Preferred Shelf Number

TK7870.15 .F54 2024

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9783527845729

Format:

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6.

Cover image for Polymeric materials for electronic packaging

Polymeric materials for electronic packaging

Polymeric materials for electronic packaging

Author

Nakamura, Shozo (Professor Emeritus), author.

Preferred Shelf Number

QD382 .C66 N35 2023

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9781394188826

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7.

Cover image for Lead-free soldering process development and reliability

Lead-free soldering process development and reliability

Lead-free soldering process development and reliability

Author

Bath, Jasbir, editor.

Preferred Shelf Number

TK7870.15 .L434 2020

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9781119482093

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8.

Cover image for Hermeticity of electronic packages

Hermeticity of electronic packages

Hermeticity of electronic packages

Author

Greenhouse, Hal. Lowry, Robert (Robert K.), 1944- Romenesko, Bruce.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9781437778779

Format:

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9.

Cover image for Adhesives technology for electronic applications materials, processes, reliability

Adhesives technology for electronic applications materials, processes, reliability

Adhesives technology for electronic applications materials, processes, reliability

Author

Licari, James J., 1930- Swanson, Dale W.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9780815515135

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10.

Cover image for Handbook of lead-free solder technology for microelectronic assemblies

Handbook of lead-free solder technology for microelectronic assemblies

Handbook of lead-free solder technology for microelectronic assemblies

Author

Puttlitz, Karl J. Stalter, Kathleen A.

Preferred Shelf Number

TK7870.15 .H3657 2004

Electronic Access

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11.

Cover image for Hermeticity of electronic packages

Hermeticity of electronic packages

Hermeticity of electronic packages

Author

Greenhouse, Hal.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9780815514350

Format:

Availability

Online Library~1

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12.

Cover image for Microwave Field-Effect Transistors Theory, design and applications

Microwave Field-Effect Transistors Theory, design and applications

Microwave Field-Effect Transistors Theory, design and applications

Author

Pengelly, Raymond S.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/SBEW016E

Format:

Availability

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