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1. 
Cover image for Practical guide to the packaging of electronics thermal and mechanical design and analysis
Practical guide to the packaging of electronics thermal and mechanical design and analysis
Author 
Jamnia, Ali, 1961-
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2. 
Cover image for Lead-free soldering in electronics science, technology and environmental impact
Lead-free soldering in electronics science, technology and environmental impact
Author 
Suganuma, Katsuaki.
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3. 
Cover image for Thermal design of electronic equipment
Thermal design of electronic equipment
Author 
Remsburg, Ralph.
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4. 
Cover image for Hermeticity of electronic packages
Hermeticity of electronic packages
Author 
Greenhouse, Hal. Lowry, Robert (Robert K.), 1944- Romenesko, Bruce.
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Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9781437778779
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5. 
Cover image for Adhesives technology for electronic applications materials, processes, reliability
Adhesives technology for electronic applications materials, processes, reliability
Author 
Licari, James J., 1930- Swanson, Dale W.
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ScienceDirect http://www.sciencedirect.com/science/book/9780815515135
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6. 
Cover image for Hermeticity of electronic packages
Hermeticity of electronic packages
Author 
Greenhouse, Hal.
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ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780815514350
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7. 
Cover image for Microwave Field-Effect Transistors Theory, design and applications
Microwave Field-Effect Transistors Theory, design and applications
Author 
Pengelly, Raymond S.
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http://dx.doi.org/10.1049/SBEW016E
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