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1. 
Cover image for Fundamentals of Electronics Circuit Analysis and Amplifier Design
Fundamentals of Electronics Circuit Analysis and Amplifier Design
Author 
Yuce, Erkan. author. Minaei, Shahram. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-032-05261-2
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Cover image for THz and Sub-THz CMOS Electronics for High-Speed Telecommunication Architectures and Circuits for Future 6G Transceivers
THz and Sub-THz CMOS Electronics for High-Speed Telecommunication Architectures and Circuits for Future 6G Transceivers
Author 
D'heer, Carl. author. Reynaert, Patrick. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-64439-9
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3. 
Cover image for A Problem-Solving Approach to Electric Circuits Volume II
A Problem-Solving Approach to Electric Circuits Volume II
Author 
Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-95634-8
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4. 
Cover image for SOC-Based Solutions in Emerging Application Domains
SOC-Based Solutions in Emerging Application Domains
Author 
Chakravarthi, Veena S. author. (orcid)0000-0002-8703-2376 Koteshwar, Shivananda R. author. (orcid)0000-0003-4299-4069 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-85044-8
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5. 
Cover image for Engineering Mathematics by Example Vol. I: Algebra and Linear Algebra
Engineering Mathematics by Example Vol. I: Algebra and Linear Algebra
Author 
Sobot, Robert. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-81076-3
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6. 
Cover image for Revealing Hybrid DC-DC Converters
Revealing Hybrid DC-DC Converters
Author 
Huang, Mo. author. (orcid)0000-0003-0497-194X Martins, Rui Paulo. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-86350-9
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7. 
Cover image for CMOS Plasma and Process Damage
CMOS Plasma and Process Damage
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Prall, Kirk. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-89029-1
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8. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4166-6
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9. 
Cover image for Safe and Sustainable Mobility by Design Safe Cities, Vehicles, Institutions, and Human Rights
Safe and Sustainable Mobility by Design Safe Cities, Vehicles, Institutions, and Human Rights
Author 
Tiwari, Geetam. editor. Varghese, Mathew. editor. Bhalla, Kavi. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-2100-2
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10. 
Cover image for Workload Dependent Mitigation Approaches for Performance Variability Ensuring Timing Guarantees of Integrated Circuits
Workload Dependent Mitigation Approaches for Performance Variability Ensuring Timing Guarantees of Integrated Circuits
Author 
Lin, Ji-Yung. author. Noltsis, Michalis. author. Soudris, Dimitrios. author. (orcid)0000-0002-6930-6847 Catthoor, Francky. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-85624-2
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11. 
Cover image for Embedded Microprocessor System Design using FPGAs
Embedded Microprocessor System Design using FPGAs
Author 
Meyer-Baese, Uwe. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-82822-5
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12. 
Cover image for Single-Event Effects, from Space to Accelerator Environments Analysis, Prediction and Hardening by Design
Single-Event Effects, from Space to Accelerator Environments Analysis, Prediction and Hardening by Design
Author 
Aguiar, Ygor Quadros de. author. (orcid)0000-0003-4416-2610 Wrobel, Frédéric. author. Autran, Jean-Luc. author. García Alía, Rubén. author. (orcid)0000-0003-4416-2610 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-71723-9
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