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1. 
Cover image for Bonding in Microsystem Technology
Bonding in Microsystem Technology
Author 
Dziuban, Jan A. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-4020-4589-1
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2. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-96-4166-6
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3. 
Cover image for Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-2140-5
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4. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-9917-8
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5. 
Cover image for The ESD control program handbook
The ESD control program handbook
Author 
Smallwood, J. M. (Jeremy M.), author.
Preferred Shelf Number 
TK7870
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781118694541
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6. 
Cover image for Flat panel display manufacturing
Flat panel display manufacturing
Author 
Souk, Jun, editor. Morozumi, Shinji, editor. Luo, Fang-Chen, editor. Bita, Ion, editor.
Preferred Shelf Number 
TK7882 .I6 F53 2018
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119161387
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7. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-45098-8
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8. 
Cover image for SiP-system in package design and simulation : Mentor EE Flow Advanced Design Guide
SiP-system in package design and simulation : Mentor EE Flow Advanced Design Guide
Author 
Li, Suny, 1974- author.
Preferred Shelf Number 
TK7874
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119045991
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9. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-44586-1
Format: 
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