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1. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume I
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume I
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-8780-7
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2. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume V
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume V
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-8824-8
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3. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume VI
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume VI
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-8828-6
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4. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume II
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume II
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-8812-5
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5. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-96-4166-6
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6. 
Cover image for Piezoelectric Bending Transducers The Physics of Their Static and Dynamic Behaviour A Textbook About Indispensable Actuators in Microtechnology, Mechatronics and Medical Technology
Piezoelectric Bending Transducers The Physics of Their Static and Dynamic Behaviour A Textbook About Indispensable Actuators in Microtechnology, Mechatronics and Medical Technology
Author 
Ballas, Rüdiger G. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-662-70689-3
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7. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume III
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume III
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-8816-3
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8. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume VII
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume VII
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-8832-3
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9. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume IV
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume IV
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-8820-0
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10. 
Cover image for Smart sensors for industry 4.0 : fundamentals, fabrication and IIoT applications
Smart sensors for industry 4.0 : fundamentals, fabrication and IIoT applications
Author 
Mishra, Brojo Kishore, 1979- editor. Mallik, Sandipan, editor. Le, Dac-Nhuong, 1983- editor.
Preferred Shelf Number 
TK7872 .D48 S63 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394214723
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11. 
Cover image for Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-2140-5
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12. 
Cover image for Electrical connectors : design, manufacture, test, and selection
Electrical connectors : design, manufacture, test, and selection
Author 
Pecht, Michael, editor. Kyeong, San, editor.
Preferred Shelf Number 
TK3521
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119679837
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