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1. 
Cover image for Principles of electrochemical conversion and storage devices
Principles of electrochemical conversion and storage devices
Author 
Huang, Kevin, author.
Preferred Shelf Number 
QD553 .H83 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527851638
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2. 
Cover image for Composites-based perovskite solar cells
Composites-based perovskite solar cells
Author 
Hahn, Yoon-Bong, author Wang, Yousheng, author Mahmoudi, Tahmineh, author
Preferred Shelf Number 
TK2963 .P47
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527844548
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3. 
Cover image for Single element semiconductors : properties and devices
Single element semiconductors : properties and devices
Author 
Shi, Yi (Electrical engineer), author. Yan, Shancheng, author.
Preferred Shelf Number 
TK7871.85 .S55 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527851782
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4. 
Cover image for Electrospinning : fundamentals, methods, and applications
Electrospinning : fundamentals, methods, and applications
Author 
Wang, Liming, editor. Qin, Xiaohong, editor.
Preferred Shelf Number 
TA418.9 .F5
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527841479
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5. 
Cover image for Handbook of 3D integration. Volume 4, Design, test, and thermal management
Handbook of 3D integration. Volume 4, Design, test, and thermal management
Author 
Franzon, Paul D., editor. Marinissen, Eric Jan, editor. Bakir, Muhannad S., editor.
Preferred Shelf Number 
TK7874.893 .H36 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527697052
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6. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-1556-9
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7. 
Cover image for Thermal Transport in Oblique Finned Micro/Minichannels
Thermal Transport in Oblique Finned Micro/Minichannels
Author 
Fan, Yan. author. Lee, Poh Seng. author. Singh, Pawan Kumar. author. Lee, Yong Jiun. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-09647-6
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8. 
Cover image for Advancements of Medical Electronics Proceedings of the First International Conference, ICAME 2015
Advancements of Medical Electronics Proceedings of the First International Conference, ICAME 2015
Author 
Gupta, Somsubhra. editor. Bag, Sandip. editor. Ganguly, Karabi. editor. Sarkar, Indranath. editor. Biswas, Papun. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-81-322-2256-9
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9. 
Cover image for Advanced Thermal Management Materials
Advanced Thermal Management Materials
Author 
Jiang, Guosheng. author. Diao, Liyong. author. Kuang, Ken. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331292.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1963-1
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10. 
Cover image for Electrical Craft Principles, Volume 1
Electrical Craft Principles, Volume 1
Author 
Whitfield, J.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBNS033E
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