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1. 
Cover image for Semiconductor Modeling For Simulating Signal, Power, and Electromagnetic Integrity
Semiconductor Modeling For Simulating Signal, Power, and Electromagnetic Integrity
Author 
Leventhal, Roy G. author. Green, Lynne. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b104647
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2. 
Cover image for Smart sensors for industry 4.0 : fundamentals, fabrication and IIoT applications
Smart sensors for industry 4.0 : fundamentals, fabrication and IIoT applications
Author 
Mishra, Brojo Kishore, 1979- editor. Mallik, Sandipan, editor. Le, Dac-Nhuong, 1983- editor.
Preferred Shelf Number 
TK7872 .D48 S63 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394214723
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3. 
Cover image for Evolving networking technologies : developments and future directions
Evolving networking technologies : developments and future directions
Author 
Gupta, Shaurya, editor.
Preferred Shelf Number 
TK5105.5 .E96 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119836667
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4. 
Cover image for Systems engineering in the fourth industrial revolution : big data, novel technologies, and modern systems engineering
Systems engineering in the fourth industrial revolution : big data, novel technologies, and modern systems engineering
Author 
Kenett, Ron, editor. Swarz, Robert S., editor. Zonnenshain, Avigdor, editor.
Preferred Shelf Number 
TA168 .S8727 2020
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119513957
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5. 
Cover image for Handbook of 3D integration. Volume 4, Design, test, and thermal management
Handbook of 3D integration. Volume 4, Design, test, and thermal management
Author 
Franzon, Paul D., editor. Marinissen, Eric Jan, editor. Bakir, Muhannad S., editor.
Preferred Shelf Number 
TK7874.893 .H36 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527697052
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