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1. 
Cover image for Micro Electro Mechanical Systems
Micro Electro Mechanical Systems
Author 
Huang, Qing-An. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-5945-2
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2. 
Cover image for Intelligent manufacturing management systems : operational applications of evolutionary digital technologies in mechanical and industrial engineering
Intelligent manufacturing management systems : operational applications of evolutionary digital technologies in mechanical and industrial engineering
Author 
Muduli, Kamalakanta. Kommula, V. P. Yadav, Devendra K. Selvan, M. Chithirai Pon. Kandasamy, Jayakrishna.
Preferred Shelf Number 
TS155.8 .I58 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119836780
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3. 
Cover image for Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Author 
Cheng, Jie. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-6165-3
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4. 
Cover image for Electromechanical Systems in Microtechnology and Mechatronics Electrical, Mechanical and Acoustic Networks, their Interactions and Applications
Electromechanical Systems in Microtechnology and Mechatronics Electrical, Mechanical and Acoustic Networks, their Interactions and Applications
Author 
Lenk, Arno. author. Ballas, Rüdiger G. author. Werthschützky, Roland. author. Pfeifer, Günther. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-10806-8
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5. 
Cover image for Recent Advances in Metrology Select Proceedings of AdMet 2022
Recent Advances in Metrology Select Proceedings of AdMet 2022
Author 
Yadav, Sanjay. editor. (orcid)0000-0002-1450-3202 Garg, Naveen. editor. Aggarwal, Shankar G. editor. (orcid)0000-0002-5809-157X Jaiswal, Shiv Kumar. editor. Kumar, Harish. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-4594-8
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6. 
Cover image for Micro and Smart Devices and Systems
Micro and Smart Devices and Systems
Author 
Vinoy, K. J. editor. Ananthasuresh, G. K. editor. Pratap, Rudra. editor. Krupanidhi, S. B. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-81-322-1913-2
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7. 
Cover image for Dynamical Systems, Wave-Based Computation and Neuro-Inspired Robots
Dynamical Systems, Wave-Based Computation and Neuro-Inspired Robots
Author 
Arena, Paolo. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-211-78775-5
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8. 
Cover image for Core-Shell Nanomaterials From Fundamentals to Applications
Core-Shell Nanomaterials From Fundamentals to Applications
Author 
Sharma, Shreya. Phogat, Peeyush. Thakur, Jahanvi. Singh, N. L.
Preferred Shelf Number 
XX(600416.1)
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527855766
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9. 
Cover image for Alternating Current Field Measurement Technique for Detection and Measurement of Cracks in Structures
Alternating Current Field Measurement Technique for Detection and Measurement of Cracks in Structures
Author 
Li, Wei. author. Yuan, Xin'an. author. Zhao, Jianming. author. Yin, Xiaokang. author. Li, Xiao. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-7255-1
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10. 
Cover image for Micro and Nanomanufacturing Volume II
Micro and Nanomanufacturing Volume II
Author 
Jackson, Mark J. editor. (orcid)0000-0001-9087-3515 Ahmed, Waqar. editor. (orcid)0000-0003-4152-5172 SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-70499-4
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11. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-96-4166-6
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12. 
Cover image for Deep learning on embedded systems : a hands-on approach using Jetson Nano and Raspberry Pi
Deep learning on embedded systems : a hands-on approach using Jetson Nano and Raspberry Pi
Author 
Arif, Tariq M., author. John Wiley & Sons, publisher.
Preferred Shelf Number 
Q325.73 .A75 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394269297
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