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1. 
Cover image for Materials and Reliability Handbook for Semiconductor Optical and Electron Devices
Materials and Reliability Handbook for Semiconductor Optical and Electron Devices
Author 
Ueda, Osamu. editor. Pearton, Stephen J. editor. SpringerLink (Online service)
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ONLINE(331478.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-4337-7
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2. 
Cover image for Printed Flexible Sensors Fabrication, Characterization and Implementation
Printed Flexible Sensors Fabrication, Characterization and Implementation
Author 
Nag, Anindya. author. Mukhopadhyay, Subhas Chandra. author. Kosel, Jurgen. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-030-13765-6
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3. 
Cover image for Modeling and Application of Flexible Electronics Packaging
Modeling and Application of Flexible Electronics Packaging
Author 
Huang, YongAn. author. Yin, Zhouping. author. Wan, Xiaodong. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-13-3627-0
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4. 
Cover image for Fundamentals of Solid State Engineering
Fundamentals of Solid State Engineering
Author 
Razeghi, Manijeh. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-75708-7
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5. 
Cover image for Solid State Lighting Reliability Part 2 Components to Systems
Solid State Lighting Reliability Part 2 Components to Systems
Author 
van Driel, Willem Dirk. editor. Fan, Xuejun. editor. Zhang, Guo Qi. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-58175-0
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6. 
Cover image for Research on the Radiation Effects and Compact Model of SiGe HBT
Research on the Radiation Effects and Compact Model of SiGe HBT
Author 
Sun, Yabin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-4612-4
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7. 
Cover image for Antenna Design Solutions for RFID Tags Based on Metamaterial-Inspired Resonators and Other Resonant Structures
Antenna Design Solutions for RFID Tags Based on Metamaterial-Inspired Resonators and Other Resonant Structures
Author 
Zuffanelli, Simone. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-62030-5
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8. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9266-5
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9. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Author 
Wymyslowski, Artur. editor. Iwamoto, Nancy. editor. Yuen, Matthew. editor. Fan, Haibo. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-12862-7
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10. 
Cover image for Reliable Design of Electronic Equipment An Engineering Guide
Reliable Design of Electronic Equipment An Engineering Guide
Author 
Natarajan, Dhanasekharan. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09111-2
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11. 
Cover image for Numerical Simulation of Mechatronic Sensors and Actuators Finite Elements for Computational Multiphysics
Numerical Simulation of Mechatronic Sensors and Actuators Finite Elements for Computational Multiphysics
Author 
Kaltenbacher, Manfred. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-40170-1
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12. 
Cover image for Integration of Functional Oxides with Semiconductors
Integration of Functional Oxides with Semiconductors
Author 
Demkov, Alexander A. author. Posadas, Agham B. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9320-4
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