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1. 
Cover image for Millimeter-Wave Integrated Circuits
Millimeter-Wave Integrated Circuits
Author 
Carey, Eoin. author. Lidholm, Sverre. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b102136
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2. 
Cover image for Integrated Circuits for Analog Signal Processing
Integrated Circuits for Analog Signal Processing
Author 
Tlelo-Cuautle, Esteban. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331269.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1383-7
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3. 
Cover image for EMC of Analog Integrated Circuits
EMC of Analog Integrated Circuits
Author 
Redouté, Jean-Michel. author. Steyaert, Michiel. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-90-481-3230-0
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4. 
Cover image for Radio Frequency Integrated Circuits and Technologies
Radio Frequency Integrated Circuits and Technologies
Author 
Ellinger, Frank. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-69325-3
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5. 
Cover image for Radio Frequency Integrated Circuits and Technologies
Radio Frequency Integrated Circuits and Technologies
Author 
Ellinger, Frank. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-35790-2
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6. 
Cover image for Fault Diagnosis of Analog Integrated Circuits
Fault Diagnosis of Analog Integrated Circuits
Author 
Kabisatpathy, Prithviraj. author. Barua, Alok. author. Sinha, Satyabroto. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b135977
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7. 
Cover image for Thermal and Power Management of Integrated Circuits
Thermal and Power Management of Integrated Circuits
Author 
Vassighi, Arman. author. Sachdev, Manoj. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/0-387-29749-9
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8. 
Cover image for Designing TSVs for 3D Integrated Circuits
Designing TSVs for 3D Integrated Circuits
Author 
Khan, Nauman. author. Hassoun, Soha. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331791.1)
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http://dx.doi.org/10.1007/978-1-4614-5508-0
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9. 
Cover image for Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Author 
Lim, Sung Kyu. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330852.1)
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http://dx.doi.org/10.1007/978-1-4419-9542-1
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10. 
Cover image for Multi-Objective Optimization in Physical Synthesis of Integrated Circuits
Multi-Objective Optimization in Physical Synthesis of Integrated Circuits
Author 
A. Papa, David. author. L. Markov, Igor. author. SpringerLink (Online service)
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ONLINE(331264.1)
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http://dx.doi.org/10.1007/978-1-4614-1356-1
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11. 
Cover image for Variation-Aware Design of Custom Integrated Circuits: A Hands-on Field Guide A Hands-on Field Guide
Variation-Aware Design of Custom Integrated Circuits: A Hands-on Field Guide A Hands-on Field Guide
Author 
McConaghy, Trent. author. Breen, Kristopher. author. Dyck, Jeffrey. author. Gupta, Amit. author. SpringerLink (Online service)
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ONLINE(331305.1)
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http://dx.doi.org/10.1007/978-1-4614-2269-3
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12. 
Cover image for Precision Instrumentation Amplifiers and Read-Out Integrated Circuits
Precision Instrumentation Amplifiers and Read-Out Integrated Circuits
Author 
Wu, Rong. author. Huijsing, Johan H. author. Makinwa, Kofi A. A. author. SpringerLink (Online service)
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ONLINE(331369.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-3731-4
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