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1. 
Cover image for Surface Integrity in Machining
Surface Integrity in Machining
Author 
Davim, J. Paulo. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-84882-874-2
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2. 
Cover image for China Satellite Navigation Conference (CSNC) 2013 Proceedings Satellite Navigation Signal System, Compatibility & Interoperability • Augmentation & Integrity Monitoring • Models & Methods
China Satellite Navigation Conference (CSNC) 2013 Proceedings Satellite Navigation Signal System, Compatibility & Interoperability • Augmentation & Integrity Monitoring • Models & Methods
Author 
Sun, Jiadong. editor. Jiao, Wenhai. editor. Wu, Haitao. editor. Shi, Chuang. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(334422.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-37404-3
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3. 
Cover image for The Effect of Hydrogen and Hydrides on the Integrity of Zirconium Alloy Components Delayed Hydride Cracking
The Effect of Hydrogen and Hydrides on the Integrity of Zirconium Alloy Components Delayed Hydride Cracking
Author 
Puls, Manfred P. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4471-4195-2
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4. 
Cover image for ICAF 2011 Structural Integrity: Influence of Efficiency and Green Imperatives Proceedings of the 26th Symposium of the International Committee on Aeronautical Fatigue, Montreal, Canada, 1-3 June 2011
ICAF 2011 Structural Integrity: Influence of Efficiency and Green Imperatives Proceedings of the 26th Symposium of the International Committee on Aeronautical Fatigue, Montreal, Canada, 1-3 June 2011
Author 
Komorowski, Jerzy. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-94-007-1664-3
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5. 
Cover image for Multiscale Fatigue Crack Initiation and Propagation of Engineering Materials: Structural Integrity and Microstructural Worthiness Fatigue Crack Growth Behaviour of Small and Large Bodies
Multiscale Fatigue Crack Initiation and Propagation of Engineering Materials: Structural Integrity and Microstructural Worthiness Fatigue Crack Growth Behaviour of Small and Large Bodies
Author 
Sih, G. C. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4020-8520-8
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6. 
Cover image for Semiconductor Modeling For Simulating Signal, Power, and Electromagnetic Integrity
Semiconductor Modeling For Simulating Signal, Power, and Electromagnetic Integrity
Author 
Leventhal, Roy G. author. Green, Lynne. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b104647
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