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Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1053-9
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2. 
Cover image for Quality of Service in Optical Burst Switched Networks
Quality of Service in Optical Burst Switched Networks
Author 
Chua, Kee Chiang. author. Gurusamy, Mohan. author. Liu, Yong. author. Phung, Minh Hoang. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-47647-6
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Online Library~1
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