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Cover image for Multisensor Fusion and Integration in the Wake of Big Data, Deep Learning and Cyber Physical System An Edition of the Selected Papers from the 2017 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI 2017)
Multisensor Fusion and Integration in the Wake of Big Data, Deep Learning and Cyber Physical System An Edition of the Selected Papers from the 2017 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI 2017)
Author 
Lee, Sukhan. editor. Ko, Hanseok. editor. Oh, Songhwai. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-90509-9
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2. 
Cover image for Multiprocessor System-on-Chip Hardware Design and Tool Integration
Multiprocessor System-on-Chip Hardware Design and Tool Integration
Author 
Hübner, Michael. editor. Becker, Jürgen. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-6460-1
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3. 
Cover image for Electromagnetic Compatibility for Device Design and System Integration
Electromagnetic Compatibility for Device Design and System Integration
Author 
Gonschorek, Karl-Heinz. author. Vick, Ralf. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-03290-5
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4. 
Cover image for Retargetable Processor System Integration into Multi-Processor System-on-Chip Platforms
Retargetable Processor System Integration into Multi-Processor System-on-Chip Platforms
Author 
Wieferink, Andreas. author. Meyr, Heinrich. author. Leupers, Rainer. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4020-8652-6
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5. 
Cover image for Parts Management Models and Applications A Supply Chain System Integration Perspective
Parts Management Models and Applications A Supply Chain System Integration Perspective
Author 
Kumar, Sameer. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/b138912
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