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1. 
Cover image for Through-silicon vias for 3D integration
Through-silicon vias for 3D integration
Author 
Lau, John.
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2. 
Cover image for Measurement and modeling of silicon heterostructure devices
Measurement and modeling of silicon heterostructure devices
Author 
Cressler, John D.
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3. 
Cover image for Three-dimensional integrated circuit design
Three-dimensional integrated circuit design
Author 
Pavlidis, Vasilis F., 1976- Friedman, Eby G.
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ScienceDirect http://www.sciencedirect.com/science/book/9780123743435
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