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1. 
Cover image for Copper Wire Bonding
Copper Wire Bonding
Author 
Chauhan, Preeti S. author. Choubey, Anupam. author. Zhong, ZhaoWei. author. Pecht, Michael G. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-5761-9
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2. 
Cover image for Micro and Nano Fabrication Tools and Processes
Micro and Nano Fabrication Tools and Processes
Author 
Gatzen, Hans H. author. Saile, Volker. author. Leuthold, Jürg. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-44395-8
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3. 
Cover image for Advances in Material Forming and Joining 5th International and 26th All India Manufacturing Technology, Design and Research Conference, AIMTDR 2014
Advances in Material Forming and Joining 5th International and 26th All India Manufacturing Technology, Design and Research Conference, AIMTDR 2014
Author 
Narayanan, R. Ganesh. editor. Dixit, Uday Shanker. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-2355-9
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4. 
Cover image for Technological Aspects of Manufacturing and Numerical Modelling of Clinch-Adhesive Joints
Technological Aspects of Manufacturing and Numerical Modelling of Clinch-Adhesive Joints
Author 
Sadowski, Tomasz. author. Balawender, Tadeusz. author. Golewski, Przemysław. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-14902-8
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