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1. 
Cover image for Bonding in Microsystem Technology
Bonding in Microsystem Technology
Author 
Dziuban, Jan A. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-4589-1
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2. 
Cover image for Metal and Alloy Bonding - An Experimental Analysis Charge Density in Metals and Alloys
Metal and Alloy Bonding - An Experimental Analysis Charge Density in Metals and Alloys
Author 
Saravanan, R. author. Rani, M. Prema. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4471-2204-3
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3. 
Cover image for Single-Molecule Magnets and Related Phenomena
Single-Molecule Magnets and Related Phenomena
Author 
Winpenny, Richard. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b104234
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4. 
Cover image for Dissimilar Metal Joining
Dissimilar Metal Joining
Author 
Dwivedi, Dheerendra Kumar. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-1897-3
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5. 
Cover image for Proceedings of the Munich Symposium on Lightweight Design 2021 Tagungsband zum Münchner Leichtbauseminar 2021
Proceedings of the Munich Symposium on Lightweight Design 2021 Tagungsband zum Münchner Leichtbauseminar 2021
Author 
Rieser, Jasper. editor. (orcid)0000-0002-0367-0224 Endress, Felix. editor. Horoschenkoff, Alexander. editor. Höfer, Philipp. editor. (orcid)0000-0001-9090-1643 Dickhut, Tobias. editor.
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https://doi.org/10.1007/978-3-662-65216-9
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