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1. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-48433-4
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2. 
Cover image for Advanced Thermal Management Materials
Advanced Thermal Management Materials
Author 
Jiang, Guosheng. author. Diao, Liyong. author. Kuang, Ken. author. SpringerLink (Online service)
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ONLINE(331292.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1963-1
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3. 
Cover image for Lead-Free Piezoelectrics
Lead-Free Piezoelectrics
Author 
Priya, Shashank. editor. Nahm, Sahn. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4419-9598-8
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4. 
Cover image for Lead Free Solder Mechanics and Reliability
Lead Free Solder Mechanics and Reliability
Author 
Pang, John Hock Lye. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4614-0463-7
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5. 
Cover image for Electronic Properties of Materials
Electronic Properties of Materials
Author 
Hummel, Rolf E. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-8164-6
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6. 
Cover image for MEMS Materials and Processes Handbook
MEMS Materials and Processes Handbook
Author 
Ghodssi, Reza. editor. Lin, Pinyen. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-47318-5
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7. 
Cover image for Sensors and Microsystems AISEM 2010 Proceedings
Sensors and Microsystems AISEM 2010 Proceedings
Author 
Neri, Giovanni. editor. Donato, Nicola. editor. d'Amico, Arnaldo. editor. Di Natale, Corrado. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-94-007-1324-6
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8. 
Cover image for Springer Handbook of Nanotechnology
Springer Handbook of Nanotechnology
Author 
Bhushan, Bharat. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-02525-9
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9. 
Cover image for Electrical Conductive Adhesives with Nanotechnologies
Electrical Conductive Adhesives with Nanotechnologies
Author 
Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-88783-8
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10. 
Cover image for Introductory MEMS Fabrication and Applications
Introductory MEMS Fabrication and Applications
Author 
Adams, Thomas M. author. Layton, Richard A. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-09511-0
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11. 
Cover image for Sensors for Environment, Health and Security Advanced Materials and Technologies
Sensors for Environment, Health and Security Advanced Materials and Technologies
Author 
Baraton, Marie-Isabelle. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4020-9009-7
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12. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-78219-5
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